EP4CGX50DF27C6

IC FPGA 310 I/O 672FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 310 2562048 49888 672-BGA

Quantity 305 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O310Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3118Number of Logic Elements/Cells49888
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2562048

Overview of EP4CGX50DF27C6 – Cyclone® IV GX FPGA, 672‑BGA

The EP4CGX50DF27C6 is a Cyclone® IV GX field programmable gate array (FPGA) in a 672‑BGA package designed for commercial applications. It provides a balance of logic capacity, embedded memory, and I/O density suitable for mid-range programmable logic designs.

Key on‑chip resources include 49,888 logic elements and approximately 2.56 Mbits of embedded memory, with a 310‑pin I/O count and a low‑voltage core supply range of 1.16 V to 1.24 V.

Key Features

  • Logic Capacity  49,888 logic elements to implement custom combinational and sequential logic functions.
  • Embedded Memory  Approximately 2.56 Mbits of on‑chip RAM for buffering, caching, and state storage.
  • I/O Density  310 user I/O pins to support multiple peripheral interfaces and parallel connections.
  • Power  Core voltage supply range of 1.16 V to 1.24 V to match system power-rail requirements.
  • Package & Mounting  672‑BGA (supplier device package: 672‑FBGA, 27×27 mm) in a surface‑mount form factor for compact PCB layouts.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C, suitable for standard temperature environments.
  • Environmental Compliance  RoHS compliant for lead‑free manufacturing processes.

Unique Advantages

  • High logic density: 49,888 logic elements provide capacity for complex glue logic, protocol bridges, and custom datapaths without external ASICs.
  • Substantial embedded memory: Approximately 2.56 Mbits of RAM reduces dependence on external memories for many buffering and state‑storage needs.
  • Ample I/O count: 310 user I/O pins enable integration of multiple high‑speed interfaces and parallel peripherals on a single device.
  • Compact BGA package: 672‑FBGA (27×27 mm) allows high‑density routing within a small PCB footprint for space‑constrained systems.
  • Low‑voltage core operation: 1.16–1.24 V supply range aligns with common system power domains to simplify power delivery design.
  • Commercial temperature and RoHS compliance: 0 °C to 85 °C operating range and RoHS status support standard commercial product lifecycles and manufacturing processes.

Why Choose EP4CGX50DF27C6?

The EP4CGX50DF27C6 positions itself as a versatile mid‑range FPGA option for commercial designs that require substantial logic resources, significant on‑chip RAM, and a high I/O count within a compact BGA footprint. Its combination of nearly 50k logic elements, approximately 2.56 Mbits of embedded memory, and 310 I/O pins makes it well suited to integration tasks that would otherwise require additional discrete components.

This device offers practical design scalability and integration density for teams seeking to consolidate functions onto a single programmable device while maintaining standard commercial temperature support and RoHS compliance.

Request a quote or submit an inquiry today to check pricing and availability for EP4CGX50DF27C6.

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