EP4CGX30CF23C7

The EP4CGX30CF23C7 is a Cyclone® IV GX field-programmable gate array from Intel, offered in a 484-ball FBGA package. It provides a balance of on-chip logic, embedded memory, and high I/O count appropriate for commercial embedded designs.

This device integrates 29,440 logic elements, approximately 1.106 Mbits of on-chip RAM, and up to 290 I/Os, delivering a compact, surface-mount FPGA solution in a 23×23 484-FBGA footprint.

Key Features

• Logic Capacity  29,440 logic elements to implement combinational and sequential logic functions in commercial FPGA designs.
• Embedded Memory  Approximately 1.106 Mbits of on-chip RAM for buffering, lookup tables, and small data structures.
• I/O Resources  Up to 290 I/O pins to support a wide range of parallel interfaces and system connectivity.
• Package and Mounting  484-FBGA package (23×23) in a surface-mount form factor for high-density PCB implementations.
• Power  Supply voltage range of 1.16 V to 1.24 V to match system power rails and design constraints.
• Operating Range and Grade  Commercial grade with an operating temperature range of 0°C to 85°C.
• Compliance  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

• Commercial Embedded Systems  Use the FPGA to implement custom logic, glue logic, and protocol handling in commercial products.
• High-Density I/O Designs  With up to 290 I/Os, the device supports boards that require broad parallel connectivity or multiple peripheral interfaces.
• Memory-Dependent Logic  The approximately 1.106 Mbits of embedded RAM make it suitable for designs that need on-chip buffering and small data stores.

Unique Advantages

• Substantial Logic Resources: 29,440 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing BOM count.
• On-Chip Memory: Approximately 1.106 Mbits of embedded RAM enables local data storage and preprocessing without external memory.
• High I/O Count: Up to 290 I/Os allow flexible interfacing to sensors, peripherals, and system buses in dense designs.
• Compact Surface-Mount Package: The 484-FBGA (23×23) package delivers high pin density in a small PCB footprint for space-constrained applications.
• Commercial Temperature and Compliance: Commercial-grade operation from 0°C to 85°C and RoHS compliance support standard manufacturing and deployment requirements.

Why Choose EP4CGX30CF23C7?

The EP4CGX30CF23C7 positions itself as a commercially graded Cyclone IV GX FPGA that combines substantial logic capacity, embedded memory, and a high I/O count in a compact 484-FBGA surface-mount package. Its supply voltage range and operating temperature make it suitable for a variety of standard commercial designs.

Manufactured by Intel, this part is appropriate for designers looking to integrate moderate to high-density programmable logic, on-chip memory, and extensive I/O into a single component while maintaining RoHS compliance and a compact board footprint.

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