EP4S100G2F40I2

The EP4S100G2F40I2 is a STRATIX® IV GT field programmable gate array (FPGA) offered in a 1517-ball FCBGA package for surface-mount applications. It provides a high logic element count and embedded RAM to support complex, high‑density digital designs.

With 228,000 logic elements, 654 user I/O, and 17,544,192 bits of on-chip RAM, this industrial‑grade device targets demanding embedded systems where integration, I/O density, and deterministic operating conditions are required.

Key Features

• Core Logic 228,000 logic elements with 9,120 LABs/CLBs to implement large-scale digital logic and custom hardware accelerators.
• Embedded Memory 17,544,192 total RAM bits—approximately 17.54 Mbits of on‑chip memory for buffering, packet storage, and local data processing.
• I/O Capacity 654 user I/O pins to support broad peripheral and interface connectivity without extensive external multiplexing.
• Package and Mounting 1517-BBGA (1517-FBGA, 40×40) surface-mount package for compact board integration and high pin density.
• Power Core voltage supply range of 920 mV to 980 mV to match system power rails and enable predictable power planning.
• Operating Environment Industrial grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for global manufacturing requirements.

Typical Applications

• Industrial Control Systems High logic capacity and extensive I/O allow integration of control algorithms, real‑time logic, and sensor/actuator interfaces within a single device.
• High‑Density Embedded Processing Large embedded RAM and abundant logic elements support custom processing engines, buffering, and protocol handling on compact boards.
• Networking and Communications The combination of logic density and 654 I/O pins enables implementation of complex packet processing, interface bridging, and custom datapath logic.

Unique Advantages

• Highly integrated design: 228,000 logic elements and approximately 17.54 Mbits of on‑chip RAM reduce external component count and simplify system architecture.
• Extensive connectivity: 654 user I/O pins provide flexibility for multi‑channel interfaces and dense peripheral connectivity without additional multiplexing hardware.
• Industrial operating range: Rated 0 °C to 100 °C and RoHS‑compliant for reliable deployment in industrial environments.
• Compact, high‑pin package: 1517‑ball FCBGA package enables a small PCB footprint while delivering high pin density for complex designs.
• Deterministic power envelope: Core voltage range of 920 mV to 980 mV aids in predictable power budgeting and system design.

Why Choose EP4S100G2F40I2?

The EP4S100G2F40I2 balances high logic density, substantial on‑chip RAM, and a large I/O complement in a compact FCBGA package tailored for industrial applications. It is suited to engineers designing complex embedded systems, communications equipment, and control platforms that require integrated resources and a predictable operating envelope.

Choosing this FPGA provides a pathway to consolidate functionality, reduce bill‑of‑materials, and maintain system robustness through defined voltage and temperature specifications, as well as RoHS compliance.

Request a quote or submit a purchasing inquiry to obtain pricing, availability, and lead‑time information for the EP4S100G2F40I2.