EP4S100G5F45I3

The EP4S100G5F45I3 is a STRATIX® IV GT Field Programmable Gate Array (FPGA) IC delivered in a 1932-BBGA FCBGA package. It provides high-capacity programmable logic with extensive on-chip memory and a large I/O count for demanding industrial applications.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 781 I/O pins, this device targets designs that require significant logic density, substantial embedded RAM, and dense external interfacing while operating within an industrial temperature range.

Key Features

• Programmable Logic 531,200 logic elements and 21,248 LABs provide a large resource pool for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory Approximately 28 Mbits of on-chip RAM (28,033,024 bits) for data buffering, FIFOs, and local storage to support memory-intensive logic.
• I/O Capacity 781 I/O pins to support dense external connectivity and multi-channel interfacing requirements.
• Power Core supply range specified from 920 mV to 980 mV to match system power-rail designs and maintain stable core operation.
• Package & Mounting 1932-BBGA (1932-FBGA, FC 45×45) FCBGA package, surface-mount compatible for compact, board-level integration.
• Temperature & Grade Industrial grade device rated for operation from 0 °C to 100 °C, suitable for factory and field equipment environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems Large logic capacity and extensive I/O support complex control algorithms, real-time interfacing, and distributed I/O aggregation in industrial equipment.
• High-Channel Data Aggregation High I/O count and embedded RAM enable multi-channel data capture, buffering, and pre-processing in instrumentation and test systems.
• Signal Processing and Networking Significant logic resources and on-chip memory support custom packet processing, protocol handling, and application-specific signal pipelines.

Unique Advantages

• High Logic Density: 531,200 logic elements empower implementation of complex state machines, accelerators, and wide parallel datapaths.
• Substantial Embedded Memory: Approximately 28 Mbits of on-chip RAM reduces the need for external memory in many buffering and low-latency tasks.
• Extensive I/O Flexibility: 781 I/O pins accommodate dense sensor, actuator, and communication interfaces without added multiplexing complexity.
• Industrial Temperature Rating: 0 °C to 100 °C operating range and industrial grade classification support deployment in factory-floor and controlled field environments.
• Compact FCBGA Package: 1932-FBGA (45×45) surface-mount package allows high-density PCB integration while keeping board footprint optimized.
• Tight Core Voltage Specification: Core supply specified between 920 mV and 980 mV for predictable power planning and thermal considerations.

Why Choose EP4S100G5F45I3?

The EP4S100G5F45I3 combines very large programmable logic capacity, substantial embedded RAM, and a high I/O count in an industrial-grade FCBGA package. This makes it well suited to engineers building complex, memory-heavy designs that require dense external interfacing and robust operation across standard industrial temperatures.

Its combination of resources supports scalable designs that consolidate functionality on a single device, helping reduce board-level component count and simplify system architecture for industrial, instrumentation, and high-channel interfacing applications.

Request a quote or submit an inquiry to receive pricing and availability for the EP4S100G5F45I3 and to discuss how this FPGA can fit your next design.