EP4S100G5F45I2N

The EP4S100G5F45I2N is a Stratix IV GT series FPGA from Intel, supplying a high-density, reconfigurable fabric for complex digital designs. This device integrates a large logic fabric, substantial embedded RAM, and extensive I/O to support demanding system-level functions.

With 531,200 logic elements, approximately 28.0 Mbits of embedded memory, and 781 I/O pins in a 1932-ball FCBGA package, the device is targeted at industrial applications requiring high integration, programmable logic capacity, and on-chip resources for timing, transceiver, and DSP-related functions.

Key Features

• High-density logic — 531,200 logic elements provide substantial capacity for large-scale digital designs and complex RTL implementations.
• Embedded memory — Total on-chip RAM: 28,033,024 bits (approximately 28.0 Mbits) for buffering, frame storage, and local data processing.
• Extensive I/O — 781 device I/O pins support broad interfacing options for parallel and serial connections.
• Structured device subsystems — Device handbook includes dedicated sections for PLLs, transceiver performance, DSP blocks, TriMatrix memory blocks, and clock-tree specifications, indicating integrated subsystems for timing, serial links, and signal processing.
• Configuration and debug — Device documentation covers configuration and JTAG specifications for programming and boundary-scan access.
• Power and operating conditions — Specified operating voltage supply range of 920 mV to 980 mV and documented power consumption and DC characteristics in the device handbook.
• Industrial grade and temperature range — Industrial grade device with an operating temperature specified from 0 °C to 100 °C.
• Package and mounting — Surface-mount 1932-BBGA (FCBGA, 45 × 45 mm supplier package) for high I/O density in compact footprints.

Typical Applications

• High-speed communications — Implement serial protocols and link layers leveraging the device handbook's transceiver and PCS latency specifications.
• Signal processing and DSP — Use embedded RAM and documented DSP block specifications for streaming data algorithms and real-time processing.
• Network and infrastructure equipment — Large logic capacity and extensive I/O support protocol offload, packet processing, and interface bridging.
• Test, measurement, and instrumentation — On-chip memory and clock-tree/PLL resources enable precision timing and data capture architectures.

Unique Advantages

• High integration density: 531,200 logic elements and ~28.0 Mbits of embedded memory reduce the need for external logic and memory components.
• Broad interfacing capability: 781 I/O pins in a single FCBGA package enable diverse system connectivity without multiple devices.
• Documented subsystem details: Comprehensive device handbook entries for DC/switching characteristics, PLLs, transceivers, DSP blocks, TriMatrix memory, and configuration simplify system-level design and verification.
• Industry-grade thermal range: Rated 0 °C to 100 °C for industrial applications where that temperature window is required.
• Compact, high-density package: 1932-ball FCBGA (45 × 45 mm) balances I/O count and board-space efficiency for dense system boards.
• Tight core supply window: Specified voltage supply range of 920 mV to 980 mV supports controlled power delivery and predictable core behavior.

Why Choose EP4S100G5F45I2N?

The EP4S100G5F45I2N combines substantial logic capacity, significant on-chip RAM, and an extensive I/O complement in a single industrial-grade FCBGA package. Its documented device-level subsystems—covering transceivers, PLLs, DSP resources, TriMatrix memory, and configuration interfaces—provide the technical foundation designers need to build complex, high-performance systems while keeping integration and board count low.

This device is well suited for teams designing industrial communications, signal-processing, and infrastructure equipment that require scalable programmable logic, high I/O density, and comprehensive device documentation to manage timing, power, and configuration considerations over the product lifecycle.

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