EP4S100G5H40I1N

The EP4S100G5H40I1N is a STRATIX® IV GT family Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It delivers large programmable logic capacity, substantial on-chip memory, and a high I/O count for systems that require dense, reconfigurable digital logic.

With 531,200 logic elements and approximately 28 Mbits of embedded memory, this industrial-grade FPGA is suited to designs that demand extensive logic resources and flexible interfacing while operating across a 0 °C to 100 °C temperature range.

Key Features

• Core Logic  531,200 logic elements with 21,248 CLBs for complex, high-density logic implementations.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM to support large buffers, lookup tables, and data processing tasks.
• I/O Capacity  654 user I/O pins to accommodate wide bus interfaces and multiple peripheral connections.
• Package & Mounting  1517-BBGA, FCBGA package (supplier device package 1517-HBGA, 42.5×42.5 mm) in a surface-mount form factor for compact PCB integration.
• Power  Core supply voltage range of 920 mV to 980 mV to match system power-rail requirements.
• Industrial Temperature Range  Rated for operation from 0 °C to 100 °C for deployment in industrial temperature environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Use the abundant logic elements and CLBs to implement complex state machines, datapaths, and custom accelerators.
• Data buffering and on-chip storage  The approximately 28 Mbits of embedded RAM supports large buffers, FIFOs, and temporary storage for streaming data.
• Multi-interface platforms  654 I/O pins enable integration with a wide range of external devices, sensors, and high-pin-count peripherals.

Unique Advantages

• High logic capacity: 531,200 logic elements provide headroom for large-scale logic integration and complex designs.
• Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces reliance on external memory for many buffering and processing tasks.
• Extensive I/O resources: 654 I/O pins allow flexible partitioning of signals and support for multiple parallel interfaces.
• Compact FCBGA package: 1517-HBGA (42.5×42.5 mm) enables dense board-level integration while maintaining a high pin count.
• Industrial-grade operation: Specified for 0 °C to 100 °C operation for reliable performance in industrial environments.
• RoHS compliant: Meets regulatory requirements for lead-free manufacturing processes.

Why Choose EP4S100G5H40I1N?

The EP4S100G5H40I1N positions itself as a high-capacity, industrial-grade FPGA choice for designs that require extensive programmable logic, abundant embedded memory, and a large number of I/O pins in a compact surface-mount FCBGA package. Its combination of 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and 654 I/Os supports complex system-level integration with reduced external components.

This part is suitable for teams developing dense digital processing, buffering, and multi-interface systems that need a scalable FPGA resource matched to industrial temperature requirements and RoHS compliance.

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