EP4S40G2F40I2N

The EP4S40G2F40I2N is a Stratix® IV GT field-programmable gate array (FPGA) offered in a 1517-ball FCBGA package. It provides a large logic fabric and significant on-chip memory, along with a high I/O count for complex, tightly integrated digital designs.

This device targets industrial-grade applications requiring substantial programmable logic capacity, abundant I/O, and embedded memory while operating within a 0 °C to 100 °C temperature range and a 0.92 V–0.98 V supply window.

Key Features

• Logic Capacity — 228,000 logic elements to implement large-scale custom logic, state machines, and datapath functions.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without immediate external memory dependency.
• I/O Resources — 654 user I/O pins to connect multiple peripherals, parallel interfaces, and board-level buses directly to the FPGA.
• Power — Core supply range of 920 mV to 980 mV for compatibility with specified core-voltage rails and power delivery designs.
• Package & Mounting — 1517-FBGA (40×40) FCBGA package, surface-mount device for compact board integration.
• Operating Conditions — Industrial-grade device with specified operating temperature from 0 °C to 100 °C.

Typical Applications

• High-density programmable logic systems — Use the 228,000 logic elements and extensive I/O to consolidate multiple discrete functions into a single FPGA.
• Embedded memory–centric designs — Leverage approximately 17.5 Mbits of on-chip RAM for packet buffering, frame storage, or streaming data operations.
• Industrial digital control and interface hubs — Industrial temperature rating and 654 I/Os enable integration with sensors, actuators, and high-pin-count peripheral arrays.

Unique Advantages

• High integration density: Large logic element count and extensive I/O reduce the need for multiple discrete logic devices and external glue logic.
• Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM helps minimize reliance on external memory for many buffering and storage tasks.
• Broad I/O connectivity: 654 I/O pins support complex board-level interfaces and multiple parallel connections without extensive routing compromises.
• Compact package footprint: 1517-ball FCBGA (40×40) package permits a compact, surface-mounted implementation for space-constrained PCB designs.
• Industrial-rated operation: Specified 0 °C to 100 °C operating range aligns with many industrial electronics environments.

Why Choose EP4S40G2F40I2N?

The EP4S40G2F40I2N combines substantial logic capacity, sizable embedded memory, and a high I/O count in a compact FCBGA package, making it suited for designs that demand integration and flexibility. Its specified supply and operating temperature range support deployment in industrial environments where consistent, predictable operation is required.

Choose this device when your design needs scalable programmable logic, meaningful on-chip RAM to reduce external memory dependence, and plentiful I/O to simplify board-level interconnects—providing a balanced platform for mid- to high-complexity digital systems.

Request a quote or submit an inquiry today to evaluate EP4S40G2F40I2N for your next design and receive pricing and availability information tailored to your requirements.