EP4SGX290KF40I4N

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17661952 291200 1517-BBGA, FCBGA

Quantity 1,097 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF40I4N – Stratix IV GX FPGA, 291,200 Logic Elements, 1517-FBGA

The EP4SGX290KF40I4N is a Stratix® IV GX field-programmable gate array (FPGA) offered in a 1517-FBGA (40×40) package and specified for industrial-grade operation. Built on the Stratix IV device family architecture, it combines high logic density, substantial embedded RAM, and extensive I/O to address demanding digital designs.

Designed for applications that require high aggregate bandwidth and advanced on-chip resources, this device targets systems that benefit from a high number of logic elements, large embedded memory, and high-speed I/O connectivity while operating across a broad industrial temperature range.

Key Features

  • Core Logic Density  Provides 291,200 logic elements to implement large-scale digital functions and complex control logic.
  • Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage.
  • Extensive I/O  744 device I/Os for dense external interfacing, parallel buses, and large connector arrays.
  • High-Speed Transceiver and Bandwidth Features  Part of the Stratix IV GX family which includes high-speed transceiver features and architecture optimized for highest aggregate data bandwidth as described in the device handbook.
  • DSP and System Integration  Built on a family architecture that includes digital signal processing (DSP) resources, PLLs, and rich clock networks to support complex signal processing and timing domains.
  • Power and Voltage  Core voltage specified from 870 mV to 930 mV, enabling precise power planning for systems using this FPGA.
  • Package and Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package designed for surface-mount assembly.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for use in industrial environments.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • High-Speed Communications and Networking  Use the Stratix IV GX family’s high-speed transceiver capabilities and large logic resource set for packet processing, protocol bridging, and network interface implementations.
  • Digital Signal Processing  Leverage the device’s DSP-oriented architecture and substantial embedded memory for real-time signal filtering, aggregation, and algorithm acceleration.
  • Memory Interface and Controllers  Implement external memory interfaces and high-throughput controllers using the on-chip RAM and abundant I/O resources.
  • High-Density I/O Systems  Deploy in systems requiring numerous parallel I/Os such as data acquisition, test equipment, and complex control panels.

Unique Advantages

  • High Logic Capacity: 291,200 logic elements enable implementation of large, consolidated designs and reduce the need for multiple devices.
  • Substantial On-Chip RAM: Approximately 17.66 Mbits of embedded memory supports buffering and intermediate storage without immediate external memory dependence.
  • Large I/O Count: 744 I/Os simplify board-level routing for multi-channel interfaces and dense connector requirements.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for industrial environments that demand extended temperature capability.
  • Package Integration: The 1517-FBGA (40×40) FCBGA package provides a compact, surface-mount footprint for high-density board designs.
  • Precise Power Specification: Core voltage range of 870 mV to 930 mV allows for accurate power-supply design and management.

Why Choose EP4SGX290KF40I4N?

The EP4SGX290KF40I4N positions itself as a high-density Stratix IV GX FPGA suitable for industrial applications that require significant logic resources, on-chip memory, and extensive I/O. Its specification set—large logic element count, approximately 17.66 Mbits of embedded RAM, 744 I/Os, and industrial temperature rating—makes it appropriate for complex signal processing, high-throughput communications, and systems integration tasks.

Designed on the Stratix IV device family architecture, this part benefits from documented transceiver, DSP, and clocking features described in the device handbook. The result is a scalable, robust platform for engineers and procurement teams building high-performance, industrial-grade digital systems.

Request a quote or submit an inquiry to evaluate EP4SGX290KF40I4N for your next high-density FPGA design.

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