EP4SGX290KF43C2

IC FPGA 880 I/O 1760FCBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 17661952 291200 1760-BBGA, FCBGA

Quantity 690 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF43C2 – Stratix® IV GX Field Programmable Gate Array (FPGA), 1760-FCBGA

The EP4SGX290KF43C2 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for commercial electronic designs that require large programmable logic capacity and extensive I/O. The device integrates 291,200 logic elements and approximately 17.66 Mbits of embedded memory in a 1760-FCBGA package.

This surface-mount FPGA operates from a 870 mV to 930 mV supply and is specified for commercial temperature operation from 0 °C to 85 °C, offering a compact, high-density solution in a 1760-ball FCBGA (1760-BBGA) footprint.

Key Features

  • Core Logic  291,200 logic elements provide substantial on-chip programmable resources for complex logic implementation and system integration.
  • Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffering, lookup tables, and state storage for data- and memory-intensive designs.
  • I/O Density  Up to 880 I/O pins available to support broad peripheral and interface connectivity requirements.
  • Package  1760-FCBGA (1760-BBGA) supply package with package indication (1760-FCBGA (42.5×42.5)) for high-density board integration.
  • Power Supply  Core supply range of 870 mV to 930 mV to match system power architectures and core voltage requirements.
  • Mounting & Grade  Surface-mount device, commercial grade, suitable for standard commercial electronic applications.
  • Operating Temperature  Rated for operation from 0 °C to 85 °C for typical commercial environments.
  • RoHS Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

  • High-density logic designs  Implement complex programmable logic and custom processing pipelines using 291,200 logic elements and substantial on-chip memory.
  • Memory-intensive architectures  Use the approximately 17.66 Mbits of embedded RAM for buffering, lookup tables, and intermediate data storage within system designs.
  • Large I/O systems  Leverage up to 880 I/O pins to interface with multiple peripherals, sensors, or external devices in commercial electronic products.
  • Compact board-level integration  Deploy the 1760-FCBGA package for space-constrained PCBs where a high pin count and dense logic are required.

Unique Advantages

  • Substantial on-chip logic: 291,200 logic elements enable integration of large custom functions that reduce external component count and simplify system design.
  • Significant embedded memory: Approximately 17.66 Mbits of RAM supports local buffering and data handling without immediate reliance on external memory.
  • Extensive I/O capacity: Up to 880 I/O pins allow broad interfacing options for multi-channel and multi-peripheral systems.
  • Compact, high-density package: The 1760-FCBGA footprint delivers high pin count and logic density in a single surface-mount package to optimize PCB layout.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial product environments.
  • RoHS compliant: Facilitates lead-free manufacturing and compliance with common environmental requirements.

Why Choose EP4SGX290KF43C2?

The EP4SGX290KF43C2 positions itself as a high-density Stratix® IV GX FPGA option for commercial designs that need a large programmable fabric, significant embedded memory, and extensive I/O in a compact FCBGA package. Its combination of 291,200 logic elements, approximately 17.66 Mbits of on-chip RAM, and up to 880 I/Os makes it suitable for consolidating functions and reducing board-level complexity.

Engineers and procurement teams seeking a surface-mount, RoHS-compliant FPGA with a 1760-FCBGA footprint and commercial temperature rating will find this device suitable for scalable, memory- and I/O-intensive implementations where a high logic capacity is required.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP4SGX290KF43C2.

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