EP4SGX290KF43C2
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 17661952 291200 1760-BBGA, FCBGA |
|---|---|
| Quantity | 690 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290KF43C2 – Stratix® IV GX Field Programmable Gate Array (FPGA), 1760-FCBGA
The EP4SGX290KF43C2 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for commercial electronic designs that require large programmable logic capacity and extensive I/O. The device integrates 291,200 logic elements and approximately 17.66 Mbits of embedded memory in a 1760-FCBGA package.
This surface-mount FPGA operates from a 870 mV to 930 mV supply and is specified for commercial temperature operation from 0 °C to 85 °C, offering a compact, high-density solution in a 1760-ball FCBGA (1760-BBGA) footprint.
Key Features
- Core Logic 291,200 logic elements provide substantial on-chip programmable resources for complex logic implementation and system integration.
- Embedded Memory Approximately 17.66 Mbits of on-chip RAM to support buffering, lookup tables, and state storage for data- and memory-intensive designs.
- I/O Density Up to 880 I/O pins available to support broad peripheral and interface connectivity requirements.
- Package 1760-FCBGA (1760-BBGA) supply package with package indication (1760-FCBGA (42.5×42.5)) for high-density board integration.
- Power Supply Core supply range of 870 mV to 930 mV to match system power architectures and core voltage requirements.
- Mounting & Grade Surface-mount device, commercial grade, suitable for standard commercial electronic applications.
- Operating Temperature Rated for operation from 0 °C to 85 °C for typical commercial environments.
- RoHS Compliance RoHS compliant to support lead-free manufacturing processes.
Typical Applications
- High-density logic designs Implement complex programmable logic and custom processing pipelines using 291,200 logic elements and substantial on-chip memory.
- Memory-intensive architectures Use the approximately 17.66 Mbits of embedded RAM for buffering, lookup tables, and intermediate data storage within system designs.
- Large I/O systems Leverage up to 880 I/O pins to interface with multiple peripherals, sensors, or external devices in commercial electronic products.
- Compact board-level integration Deploy the 1760-FCBGA package for space-constrained PCBs where a high pin count and dense logic are required.
Unique Advantages
- Substantial on-chip logic: 291,200 logic elements enable integration of large custom functions that reduce external component count and simplify system design.
- Significant embedded memory: Approximately 17.66 Mbits of RAM supports local buffering and data handling without immediate reliance on external memory.
- Extensive I/O capacity: Up to 880 I/O pins allow broad interfacing options for multi-channel and multi-peripheral systems.
- Compact, high-density package: The 1760-FCBGA footprint delivers high pin count and logic density in a single surface-mount package to optimize PCB layout.
- Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial product environments.
- RoHS compliant: Facilitates lead-free manufacturing and compliance with common environmental requirements.
Why Choose EP4SGX290KF43C2?
The EP4SGX290KF43C2 positions itself as a high-density Stratix® IV GX FPGA option for commercial designs that need a large programmable fabric, significant embedded memory, and extensive I/O in a compact FCBGA package. Its combination of 291,200 logic elements, approximately 17.66 Mbits of on-chip RAM, and up to 880 I/Os makes it suitable for consolidating functions and reducing board-level complexity.
Engineers and procurement teams seeking a surface-mount, RoHS-compliant FPGA with a 1760-FCBGA footprint and commercial temperature rating will find this device suitable for scalable, memory- and I/O-intensive implementations where a high logic capacity is required.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP4SGX290KF43C2.

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