EP4SGX290KF43C2N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 17661952 291200 1760-BBGA, FCBGA |
|---|---|
| Quantity | 286 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290KF43C2N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC, 1760-FCBGA
The EP4SGX290KF43C2N is an Intel Stratix® IV GX field programmable gate array supplied in a 1760-FCBGA package. It delivers a high logic element count and substantial embedded memory in a surface-mount, RoHS-compliant package suitable for commercial-temperature applications.
Key device attributes include 291,200 logic elements, approximately 17.66 Mbits of embedded RAM, and 880 I/O pins, all operating from an 870 mV to 930 mV supply and rated for 0 °C to 85 °C.
Key Features
- Core Logic 291,200 logic elements provide a high-density programmable fabric for complex digital designs.
- Embedded Memory Approximately 17.66 Mbits of on-chip RAM to support buffering, FIFOs, and data-path storage without external memory in many use cases.
- I/O Capacity 880 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Power Supply Operates from an 870 mV to 930 mV supply range, enabling designs targeted to that core-voltage window.
- Package & Mounting 1760-ball FCBGA (1760-BBGA) surface-mount package; supplier device package dimension 42.5 × 42.5 mm for compact board-level integration.
- Operating Range & Grade Commercial grade with an operating temperature from 0 °C to 85 °C.
- Standards Compliance RoHS compliant to meet environmental and manufacturing requirements.
Unique Advantages
- High logic density: 291,200 logic elements enable integration of large, complex functions on a single device, reducing board-level component count.
- Significant on-chip memory: Approximately 17.66 Mbits of embedded RAM supports demanding data buffering and reduces dependence on external memory components.
- Extensive I/O: 880 I/O pins provide flexibility for diverse interfaces and high-pin-count system requirements.
- Compact FCBGA package: 1760-ball FCBGA in a 42.5 × 42.5 mm footprint simplifies routing and saves PCB area relative to multi-device solutions.
- Low-voltage core operation: 870 mV–930 mV supply range supports designs targeting low-voltage FPGA cores.
- Commercial-temperature qualification: Rated 0 °C to 85 °C for standard commercial deployments with RoHS compliance for manufacturing compatibility.
Why Choose EP4SGX290KF43C2N?
The EP4SGX290KF43C2N combines a high logic element count, substantial embedded memory, and a large I/O complement in a compact 1760-FCBGA surface-mount package. These attributes make it well suited for commercial designs that require dense programmable logic, significant on-chip buffering, and broad interface support while maintaining a compact board footprint.
For teams focused on scalable, integrated FPGA-based solutions, this Stratix® IV GX device offers a balance of capacity, connectivity, and manufacturability, backed by Intel’s device lineage and RoHS compliance.
Request a quote or submit a pricing and availability inquiry for EP4SGX290KF43C2N to receive current lead-time and procurement options.

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