EP4SGX290KF43C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 519 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290KF43C3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX290KF43C3G is an Intel Stratix IV family FPGA offering a high-density programmable fabric for complex digital logic integration. It combines a large number of logic elements, significant on-chip memory, and a high I/O count to address demanding applications that require flexible, reconfigurable hardware.
Designed for commercial-grade systems, this surface-mount FCBGA device provides a concentrated set of capabilities—dense logic, embedded memory, and broad I/O—while operating within a defined commercial temperature and voltage range for reliable deployment in networking, communications, and data-processing applications.
Key Features
- Programmable Fabric 291,200 logic elements for implementing complex digital functions and custom hardware accelerators.
- Embedded Memory Approximately 17.66 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for high-throughput data paths.
- I/O Density 880 user I/O pins, enabling broad interfacing to peripherals, memory devices, and high-speed connectors.
- Package and Mounting 1760-ball FCBGA package (1760-FCBGA, 42.5 × 42.5 mm) in a surface-mount form factor for compact, high-density board integration.
- Power Supply Range Core voltage supply specified from 870 mV to 930 mV to meet board power-rail design requirements.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation, suitable for commercial environments.
- Standards Compliance RoHS compliant for regulatory and manufacturing alignment.
Typical Applications
- High‑performance networking and communications Leveraging the Stratix IV family architecture and high I/O count for protocol bridging, packet processing, and interface aggregation.
- Data‑plane acceleration Implement custom data-paths and hardware accelerators using the large logic element count and on-chip RAM.
- Signal processing and imaging Use the embedded memory and dense logic fabric to implement real‑time processing pipelines for video and sensor data.
- High‑speed interface and protocol implementation High I/O density supports integration with multiple serial and parallel interfaces in compact system designs.
Unique Advantages
- High logic density: 291,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
- Substantial on‑chip memory: Approximately 17.66 Mbits of embedded RAM supports buffering and local storage to keep latency low and throughput high.
- Extensive I/O capability: 880 user I/Os provide the flexibility to connect multiple peripherals, memory interfaces, and transceivers without external glue logic.
- Compact high‑ball‑count package: 1760-FCBGA (42.5 × 42.5 mm) offers dense integration for space-constrained, performance-oriented PCBs.
- Commercial operating range: Specified 0 °C to 85 °C operation and RoHS compliance simplify qualification for commercial product lines.
- Defined core voltage window: 870–930 mV core supply specification helps align power-supply design and thermal planning for system reliability.
Why Choose EP4SGX290KF43C3G?
The EP4SGX290KF43C3G positions itself as a high‑capacity, surface‑mount Stratix IV FPGA suitable for commercial applications that require dense logic, significant embedded memory, and broad I/O. Its feature set supports consolidation of complex digital subsystems and implementation of high-throughput data paths within a single device footprint.
This device is appropriate for engineering teams building networking, communications, and data‑processing systems who need a scalable, reconfigurable platform with clear power, package, and temperature specifications. Its combination of logic density, embedded RAM, and I/O count supports long-term design flexibility and platform consolidation.
Request a quote or submit a pricing inquiry to evaluate EP4SGX290KF43C3G for your next design and to confirm availability and lead times.

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