EP4SGX290KF43C3G

IC FPGA 880 I/O 1760FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 519 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF43C3G – Field Programmable Gate Array (FPGA) IC

The EP4SGX290KF43C3G is an Intel Stratix IV family FPGA offering a high-density programmable fabric for complex digital logic integration. It combines a large number of logic elements, significant on-chip memory, and a high I/O count to address demanding applications that require flexible, reconfigurable hardware.

Designed for commercial-grade systems, this surface-mount FCBGA device provides a concentrated set of capabilities—dense logic, embedded memory, and broad I/O—while operating within a defined commercial temperature and voltage range for reliable deployment in networking, communications, and data-processing applications.

Key Features

  • Programmable Fabric  291,200 logic elements for implementing complex digital functions and custom hardware accelerators.
  • Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for high-throughput data paths.
  • I/O Density  880 user I/O pins, enabling broad interfacing to peripherals, memory devices, and high-speed connectors.
  • Package and Mounting  1760-ball FCBGA package (1760-FCBGA, 42.5 × 42.5 mm) in a surface-mount form factor for compact, high-density board integration.
  • Power Supply Range  Core voltage supply specified from 870 mV to 930 mV to meet board power-rail design requirements.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial environments.
  • Standards Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

  • High‑performance networking and communications  Leveraging the Stratix IV family architecture and high I/O count for protocol bridging, packet processing, and interface aggregation.
  • Data‑plane acceleration  Implement custom data-paths and hardware accelerators using the large logic element count and on-chip RAM.
  • Signal processing and imaging  Use the embedded memory and dense logic fabric to implement real‑time processing pipelines for video and sensor data.
  • High‑speed interface and protocol implementation  High I/O density supports integration with multiple serial and parallel interfaces in compact system designs.

Unique Advantages

  • High logic density: 291,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
  • Substantial on‑chip memory: Approximately 17.66 Mbits of embedded RAM supports buffering and local storage to keep latency low and throughput high.
  • Extensive I/O capability: 880 user I/Os provide the flexibility to connect multiple peripherals, memory interfaces, and transceivers without external glue logic.
  • Compact high‑ball‑count package: 1760-FCBGA (42.5 × 42.5 mm) offers dense integration for space-constrained, performance-oriented PCBs.
  • Commercial operating range: Specified 0 °C to 85 °C operation and RoHS compliance simplify qualification for commercial product lines.
  • Defined core voltage window: 870–930 mV core supply specification helps align power-supply design and thermal planning for system reliability.

Why Choose EP4SGX290KF43C3G?

The EP4SGX290KF43C3G positions itself as a high‑capacity, surface‑mount Stratix IV FPGA suitable for commercial applications that require dense logic, significant embedded memory, and broad I/O. Its feature set supports consolidation of complex digital subsystems and implementation of high-throughput data paths within a single device footprint.

This device is appropriate for engineering teams building networking, communications, and data‑processing systems who need a scalable, reconfigurable platform with clear power, package, and temperature specifications. Its combination of logic density, embedded RAM, and I/O count supports long-term design flexibility and platform consolidation.

Request a quote or submit a pricing inquiry to evaluate EP4SGX290KF43C3G for your next design and to confirm availability and lead times.

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