EP4SGX290KF43C4G

The EP4SGX290KF43C4G is an Intel Stratix IV–class Field Programmable Gate Array presented in a high-pin-count FCBGA package. It delivers a large, reprogrammable logic fabric with on‑chip memory and extensive I/O that supports complex system integration for communications, high‑performance signal processing, and advanced prototyping.

Designed for commercial-grade applications, this device combines high logic density, significant embedded memory, and a compact 1760‑ball FCBGA package to support designs that require dense routing and broad external interfacing while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — 291,200 logic elements (cells) to implement large, complex logic designs and system-level functions on a single device.
• Embedded Memory — Approximately 17.66 Mbits of on‑chip RAM for buffering, lookup tables, and data storage close to the logic fabric.
• I/O Resources — 880 I/O pins to support dense external connectivity and multiple parallel interfaces.
• Power and Supply — Core voltage supply range of 870 mV to 930 mV to match platform power architectures and regulator designs.
• Package and Mounting — Available in a 1760‑ball FCBGA (42.5 × 42.5 mm) / 1760‑BBGA package; surface‑mount mounting for PCB assembly.
• Operating Conditions — Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant to meet common environmental and assembly requirements.

Typical Applications

• High‑Performance Communications — Large logic capacity and extensive I/O allow implementation of protocol engines, packet processing, and custom interface bridging.
• Signal Processing — Substantial embedded RAM and dense logic fabric support DSP pipelines, buffering, and real‑time data manipulation tasks.
• Prototyping and System Integration — High pin count and FCBGA packaging enable board‑level prototyping and integration of complex subsystems on a single FPGA.

Unique Advantages

• High Logic Density: 291,200 logic elements provide the capacity to consolidate multiple functions and reduce the need for discrete logic ICs.
• Significant On‑Chip Memory: Approximately 17.66 Mbits of embedded RAM reduces external memory dependence and improves data path latency.
• Broad I/O Count: 880 I/Os enable flexible routing to external peripherals, memory devices, and multi‑lane interfaces without extensive board redesign.
• Compact, High‑Pin Package: The 1760‑ball FCBGA (42.5 × 42.5 mm) package delivers high pin density in a surface‑mount form factor suitable for space‑constrained PCBs.
• Commercial Temperature Range: Rated 0 °C to 85 °C for deployment in standard commercial environments and systems.
• RoHS Compliant: Meets lead‑free and restricted‑substance compliance required for modern manufacturing processes.

Why Choose EP4SGX290KF43C4G?

The EP4SGX290KF43C4G is positioned for designs that require substantial programmable logic, on‑chip memory, and a large number of I/Os in a single, surface‑mount package. Its combination of logic capacity, approximately 17.66 Mbits of embedded RAM, and 880 I/Os supports consolidation of complex subsystems and reduces BOM complexity.

Engineers and system integrators targeting communications, high‑performance signal processing, or advanced prototyping projects will find this device well suited to platforms that operate within commercial temperature and power envelopes and require a compact FCBGA footprint with RoHS compliance.

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