EP4SGX290KF43I3

The EP4SGX290KF43I3 is a Stratix IV GX FPGA in a 1760-ball FCBGA package, designed for high-density programmable logic and I/O integration. It provides substantial on-chip logic and memory resources together with the Stratix IV device family features described in the device handbook, including high-speed transceiver support and broad protocol enablement.

This device targets industrial applications that require significant logic capacity, large embedded RAM, and a wide complement of I/O while operating across an extended temperature range and standard surface-mount package formats.

Key Features

• Core Logic 291,200 logic elements to implement complex digital systems and custom processing pipelines.
• Embedded Memory Approximately 17.66 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density 880 I/O pins to support extensive peripheral, memory, and high-speed interface requirements.
• Stratix IV GX Family Features Device handbook entries list architecture features such as high-speed transceiver capabilities, wide protocol support, embedded DSP blocks, clock networks, and PLLs that characterize the Stratix IV GX series.
• Package & Mounting 1760-FCBGA (42.5 × 42.5 mm) package, surface-mount compatible for compact, high-density board designs.
• Power Core voltage supply range: 870 mV to 930 mV.
• Thermal & Grade Industrial grade operation from −40 °C to 100 °C for extended-temperature deployments.
• Compliance RoHS compliant.

Typical Applications

• High‑performance networking equipment — Use the device’s large logic capacity and high I/O count to implement packet processing, switching, or protocol bridging functions.
• Telecommunications and data transport — Stratix IV GX family transceiver and protocol support (as documented in the device handbook) make this device suitable for high‑bandwidth serial links and interface aggregation.
• Signal processing and DSP offload — Substantial logic elements and embedded RAM enable custom DSP pipelines and real‑time data conditioning.
• Memory interface controllers — High I/O density supports external memory interfaces and wide data buses for buffering and memory controllers.

Unique Advantages

• High logic density: 291,200 logic elements allow integration of large, complex designs on a single device, reducing BOM and board area.
• Significant on‑chip memory: Approximately 17.66 Mbits of embedded RAM supports large buffers and on‑chip data storage to improve throughput.
• Extensive I/O availability: 880 I/Os enable broad connectivity to external devices, interfaces, and memory peripherals without external multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding thermal environments.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) provides high pin count in a compact, surface-mount form factor for dense board layouts.
• Family-level transceiver and protocol support: As part of the Stratix IV GX family, the device benefits from documented high-speed transceiver features and a broad range of protocol support in the device handbook.

Why Choose EP4SGX290KF43I3?

The EP4SGX290KF43I3 combines a very large logic fabric, substantial embedded RAM, and a high I/O count in a single industrial‑grade FCBGA package, making it a strong choice for designs that require dense integration of programmable logic, memory interfaces, and high‑speed I/O. Its documented Stratix IV GX family features—such as transceiver capabilities, DSP resources, and robust clocking structures—support demanding communication, signal processing, and system‑level integration tasks.

This device is well suited to engineering teams building scalable, high‑bandwidth systems who require a reliable platform with clear device-level specifications for voltage, temperature, package, and I/O capacity.

Request a quote or submit a parts inquiry to get pricing and availability for EP4SGX290KF43I3. Our team can provide lead‑time and ordering information to support your design schedule.