EP4SGX290KF43I3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 17661952 291200 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,572 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290KF43I3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 17661952 291200 1760-BBGA, FCBGA
The EP4SGX290KF43I3N is a Stratix® IV GX field programmable gate array (FPGA) supplied in a 1760-ball FCBGA package. It delivers a high-density programmable logic fabric with a large number of I/O and substantial on-chip memory for complex, configurable digital designs.
With 291,200 logic elements, approximately 17.66 Mbits of embedded memory and 880 I/O pins, this industrial-grade device targets applications that require high integration, flexible I/O connectivity and sustained operation across an extended temperature range.
Key Features
- Core Logic 291,200 logic elements and 11,648 logic blocks provide extensive programmable logic resources for complex custom functions and parallel processing.
- Embedded Memory Approximately 17.66 Mbits of on-chip RAM to support buffering, look-up tables and local data storage without external memory.
- I/O Capacity 880 I/O pins enable dense board-level interfacing and support for multiple external peripherals and buses.
- Package 1760-ball FCBGA package (supplier device package: 1760-FCBGA, 42.5 × 42.5 mm) for a compact, high-pin-count footprint.
- Power Requirements Specified core supply range from 870 mV to 930 mV for core power planning and regulation design.
- Operating Temperature Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Mounting Surface-mount device suitable for modern PCB assembly and automated placement.
- Compliance RoHS compliant to meet common environmental and regulatory restrictions.
Typical Applications
- Industrial Automation Programmable control logic, I/O aggregation and custom protocol handling where an industrial-grade FPGA enables flexible system updates and high integration.
- Signal Processing High-density logic and large embedded RAM support implementable processing pipelines and buffering for digital signal conditioning.
- High-Density I/O Systems Applications requiring numerous external interfaces can leverage 880 I/O pins to consolidate multiple peripherals and buses on a single device.
Unique Advantages
- High logic density: 291,200 logic elements reduce the need for multiple discrete devices, simplifying system architecture and lowering BOM complexity.
- Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM provide local storage for buffering and state machines, decreasing external memory dependence.
- Extensive I/O: 880 I/O pins enable flexible interfacing and help minimize external multiplexing or additional interface chips.
- Industrial temperature capability: Rated from −40 °C to 100 °C to support deployments in demanding thermal environments.
- Compact, high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) consolidates many signals in a manageable PCB footprint for space-constrained designs.
- RoHS compliant: Conforms to common environmental requirements for modern electronics projects and supply chains.
Why Choose EP4SGX290KF43I3N?
The EP4SGX290KF43I3N positions itself as a high-density, industrial-grade Stratix IV GX FPGA suited to designs that demand extensive programmable logic, ample embedded memory and broad I/O connectivity. Its combination of 291,200 logic elements, approximately 17.66 Mbits of on-chip RAM and 880 I/Os supports complex, integrated implementations while helping reduce external component count.
Engineers and procurement teams seeking a scalable, reliable programmable device for industrial automation, signal processing or high-density interface applications will find this FPGA offers a clear balance of integration, environmental tolerance and packaging suitable for production assemblies.
Request a quote or submit a purchase inquiry today to discuss availability and volume pricing for EP4SGX290KF43I3N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018