EP4SGX290KF43I3N

IC FPGA 880 I/O 1760FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 17661952 291200 1760-BBGA, FCBGA

Quantity 1,572 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF43I3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 17661952 291200 1760-BBGA, FCBGA

The EP4SGX290KF43I3N is a Stratix® IV GX field programmable gate array (FPGA) supplied in a 1760-ball FCBGA package. It delivers a high-density programmable logic fabric with a large number of I/O and substantial on-chip memory for complex, configurable digital designs.

With 291,200 logic elements, approximately 17.66 Mbits of embedded memory and 880 I/O pins, this industrial-grade device targets applications that require high integration, flexible I/O connectivity and sustained operation across an extended temperature range.

Key Features

  • Core Logic  291,200 logic elements and 11,648 logic blocks provide extensive programmable logic resources for complex custom functions and parallel processing.
  • Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffering, look-up tables and local data storage without external memory.
  • I/O Capacity  880 I/O pins enable dense board-level interfacing and support for multiple external peripherals and buses.
  • Package  1760-ball FCBGA package (supplier device package: 1760-FCBGA, 42.5 × 42.5 mm) for a compact, high-pin-count footprint.
  • Power Requirements  Specified core supply range from 870 mV to 930 mV for core power planning and regulation design.
  • Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Mounting  Surface-mount device suitable for modern PCB assembly and automated placement.
  • Compliance  RoHS compliant to meet common environmental and regulatory restrictions.

Typical Applications

  • Industrial Automation  Programmable control logic, I/O aggregation and custom protocol handling where an industrial-grade FPGA enables flexible system updates and high integration.
  • Signal Processing  High-density logic and large embedded RAM support implementable processing pipelines and buffering for digital signal conditioning.
  • High-Density I/O Systems  Applications requiring numerous external interfaces can leverage 880 I/O pins to consolidate multiple peripherals and buses on a single device.

Unique Advantages

  • High logic density: 291,200 logic elements reduce the need for multiple discrete devices, simplifying system architecture and lowering BOM complexity.
  • Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM provide local storage for buffering and state machines, decreasing external memory dependence.
  • Extensive I/O: 880 I/O pins enable flexible interfacing and help minimize external multiplexing or additional interface chips.
  • Industrial temperature capability: Rated from −40 °C to 100 °C to support deployments in demanding thermal environments.
  • Compact, high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) consolidates many signals in a manageable PCB footprint for space-constrained designs.
  • RoHS compliant: Conforms to common environmental requirements for modern electronics projects and supply chains.

Why Choose EP4SGX290KF43I3N?

The EP4SGX290KF43I3N positions itself as a high-density, industrial-grade Stratix IV GX FPGA suited to designs that demand extensive programmable logic, ample embedded memory and broad I/O connectivity. Its combination of 291,200 logic elements, approximately 17.66 Mbits of on-chip RAM and 880 I/Os supports complex, integrated implementations while helping reduce external component count.

Engineers and procurement teams seeking a scalable, reliable programmable device for industrial automation, signal processing or high-density interface applications will find this FPGA offers a clear balance of integration, environmental tolerance and packaging suitable for production assemblies.

Request a quote or submit a purchase inquiry today to discuss availability and volume pricing for EP4SGX290KF43I3N.

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