EP4SGX290NF45C2

The EP4SGX290NF45C2 is a Stratix® IV GX field programmable gate array from Intel, delivering a high-capacity programmable fabric in a commercial-grade FCBGA package. Its on-chip resources include 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and up to 920 I/Os, making it suitable for complex FPGA-based implementations that require large logic and memory resources.

Packaged in a 1932-ball BGA (45×45 mm) and specified for surface-mount assembly, the device operates from a core supply of 870 mV to 930 mV and is rated for commercial temperature operation from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Capacity — 291,200 logic elements to support dense, multi-function programmable designs.
• Logic Array Blocks (LABs) — 11,648 LABs providing the structured logic resources used across the device.
• Embedded Memory — Approximately 17.66 Mbits of on-chip RAM for buffering, local storage and intermediate data processing.
• I/O Density — Up to 920 I/Os to support extensive external interfacing and multiple parallel channels.
• Power — Core voltage supply specified at 870 mV to 930 mV, allowing designers to plan power delivery and sequencing precisely.
• Package — 1932-ball BGA package (FCBGA, 45×45 mm) optimized for high I/O and dense routing in surface-mount assemblies.
• Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance — RoHS compliant.

Unique Advantages

• High logic density: 291,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM supports data buffering and local storage without external memory for many workloads.
• Extensive I/O capability: Up to 920 I/Os accommodate complex interfacing requirements for multi-channel and multi-protocol systems.
• Compact FCBGA packaging: The 1932-ball BGA (45×45 mm) package delivers high I/O in a form factor suited to surface-mount manufacturing and dense PCB layouts.
• Predictable power envelope: A clearly defined core supply range of 870 mV to 930 mV simplifies power supply design and system integration.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.

Why Choose EP4SGX290NF45C2?

The EP4SGX290NF45C2 combines substantial logic capacity, abundant embedded memory and a high I/O count in a single Stratix® IV GX FCBGA package from Intel. These attributes make it a strong choice for designers who need to implement complex, high-density programmable logic solutions within a commercial temperature range and a defined power envelope.

For projects that require consolidation of multiple functions, extensive on-chip buffering and large interfacing requirements, this device provides the resource set to simplify system architecture and reduce component count while maintaining predictable thermal and electrical parameters.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX290NF45C2.