EP4SGX290NF45C2N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 17661952 291200 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,709 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290NF45C2N – Stratix® IV GX FPGA, 1932-BBGA FCBGA
The EP4SGX290NF45C2N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, offered in a 1932-ball FCBGA package. This commercial-grade device provides a high logic capacity and substantial embedded memory for complex digital designs.
Key on-chip resources include 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 920 I/O pins. The device is specified for surface-mount assembly, operates from 0 °C to 85 °C, and uses a core supply range of 870 mV to 930 mV.
Key Features
- Core Logic 291,200 logic elements for implementing large-scale digital logic and custom processing functions.
- Embedded Memory Approximately 17.66 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory.
- I/O Density 920 available I/O pins to support extensive external interfaces and dense system integration.
- Power Supply Core voltage range specified at 870 mV to 930 mV for the device supply.
- Package & Mounting 1932-ball BGA (FCBGA) package, supplier package specified as 1932-FBGA, FC (45×45), designed for surface-mount PCB assembly.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C for typical commercial applications.
- Regulatory RoHS compliant.
Unique Advantages
- High logic capacity: 291,200 logic elements enable integration of complex functions and consolidation of multiple subsystems on a single FPGA.
- Large on-chip memory: Approximately 17.66 Mbits of embedded RAM reduce reliance on external memory and simplify board-level design.
- Extensive I/O count: 920 I/Os support numerous peripherals and high-pin-count interfaces without additional multiplexing.
- Compact BGA package: 1932-ball FCBGA (45×45) provides a dense, surface-mount form factor for space-constrained boards.
- Commercial temperature rating: Specified 0 °C to 85 °C operation aligns the device with mainstream commercial electronic products.
- RoHS compliant: Meets lead-free material requirements for environmentally conscious designs.
Why Choose EP4SGX290NF45C2N?
The EP4SGX290NF45C2N is positioned for commercial designs that require a high density of programmable logic, large embedded memory, and substantial I/O capability in a compact FCBGA package. Its combination of 291,200 logic elements, roughly 17.66 Mbits of on-chip RAM, and 920 I/Os makes it suitable for systems that benefit from integration and reduced external BOM complexity.
Choose this device when your design priorities include on-chip capacity, dense external connectivity, and a commercial temperature profile, backed by Intel’s Stratix IV GX family heritage and RoHS compliance for modern manufacturing flows.
Request a quote or contact sales to discuss availability, lead times, and pricing for EP4SGX290NF45C2N.

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