EP4SGX290NF45C2N

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 17661952 291200 1932-BBGA, FCBGA

Quantity 1,709 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290NF45C2N – Stratix® IV GX FPGA, 1932-BBGA FCBGA

The EP4SGX290NF45C2N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, offered in a 1932-ball FCBGA package. This commercial-grade device provides a high logic capacity and substantial embedded memory for complex digital designs.

Key on-chip resources include 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 920 I/O pins. The device is specified for surface-mount assembly, operates from 0 °C to 85 °C, and uses a core supply range of 870 mV to 930 mV.

Key Features

  • Core Logic  291,200 logic elements for implementing large-scale digital logic and custom processing functions.
  • Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory.
  • I/O Density  920 available I/O pins to support extensive external interfaces and dense system integration.
  • Power Supply  Core voltage range specified at 870 mV to 930 mV for the device supply.
  • Package & Mounting  1932-ball BGA (FCBGA) package, supplier package specified as 1932-FBGA, FC (45×45), designed for surface-mount PCB assembly.
  • Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for typical commercial applications.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High logic capacity: 291,200 logic elements enable integration of complex functions and consolidation of multiple subsystems on a single FPGA.
  • Large on-chip memory: Approximately 17.66 Mbits of embedded RAM reduce reliance on external memory and simplify board-level design.
  • Extensive I/O count: 920 I/Os support numerous peripherals and high-pin-count interfaces without additional multiplexing.
  • Compact BGA package: 1932-ball FCBGA (45×45) provides a dense, surface-mount form factor for space-constrained boards.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation aligns the device with mainstream commercial electronic products.
  • RoHS compliant: Meets lead-free material requirements for environmentally conscious designs.

Why Choose EP4SGX290NF45C2N?

The EP4SGX290NF45C2N is positioned for commercial designs that require a high density of programmable logic, large embedded memory, and substantial I/O capability in a compact FCBGA package. Its combination of 291,200 logic elements, roughly 17.66 Mbits of on-chip RAM, and 920 I/Os makes it suitable for systems that benefit from integration and reduced external BOM complexity.

Choose this device when your design priorities include on-chip capacity, dense external connectivity, and a commercial temperature profile, backed by Intel’s Stratix IV GX family heritage and RoHS compliance for modern manufacturing flows.

Request a quote or contact sales to discuss availability, lead times, and pricing for EP4SGX290NF45C2N.

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