EP4SGX290NF45C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 395 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290NF45C3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX290NF45C3G is an Intel (Altera) Stratix IV family FPGA device designed for advanced system integration. It provides a large logic fabric and substantial on-chip memory within a high-density FCBGA package, suitable for complex digital designs.
Documented in the Stratix IV device handbook, the device targets applications that require extensive logic resources, abundant I/O, and support for on-chip memory and high-speed subsystem features described in the family handbook.
Key Features
- Logic Capacity — 291,200 logic elements to implement large-scale digital logic and customized processing pipelines.
- Embedded Memory — Approximately 17.7 Mbits of on-chip RAM for buffers, FIFOs, and local data storage within the FPGA fabric.
- I/O Count — 920 general-purpose I/O pins to support dense board-level connectivity and multiple peripheral interfaces.
- Stratix IV Architecture — Device references in the Stratix IV Device Handbook show architecture features such as DSP blocks, PLLs, clock networks, external memory interfaces, and high-speed transceiver capabilities.
- Package and Mounting — 1932-ball FCBGA (45 × 45) in a surface-mount package for high-density PCB integration.
- Core Voltage Range — Core supply specified at 870 mV to 930 mV (0.87–0.93 V) to support the device’s internal logic domains.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for commercial-class electronic systems.
- RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly and manufacturing.
Typical Applications
- High-speed serial communications — Use with the Stratix IV transceiver and protocol support described in the device handbook to implement serial link endpoints and protocol bridges.
- Digital signal processing — Deploy DSP blocks and abundant logic and memory for signal filtering, encoding/decoding, and real-time data manipulation.
- External memory controllers — Implement complex memory interfaces and controllers leveraging the family’s external memory interface features.
- System integration and prototyping — Large logic capacity and extensive I/O make it suitable for consolidating multiple functions onto a single programmable device during development or in production systems.
Unique Advantages
- High logic density: 291,200 logic elements enable complex, consolidated designs and multi-function integration on a single device.
- Substantial on-chip memory: Approximately 17.7 Mbits of embedded RAM reduce external memory requirements for many buffering and storage needs.
- Extensive I/O resources: 920 I/O pins support dense peripheral interfaces and flexible board-level connectivity without immediate need for external expanders.
- Compact, high-density package: 1932-ball FCBGA (45×45) allows a high-pin-count implementation while minimizing PCB footprint.
- Architecture-level features: Device falls under Stratix IV family documentation that describes DSP blocks, clock networks, PLLs, and high-speed transceiver support—useful for system-level integration decisions.
- Regulatory and assembly readiness: RoHS compliance and surface-mount package make the device suitable for modern lead-free production workflows.
Why Choose EP4SGX290NF45C3G?
EP4SGX290NF45C3G combines a large logic fabric, ample embedded memory, and a very high I/O count within a compact FCBGA package, making it a strong option for engineers needing to consolidate high-density digital functions on a single FPGA. Its specifications and documented Stratix IV architecture features enable implementation of sophisticated signal processing, memory interfacing, and high-speed communication functions.
This device is aimed at designers and teams building commercial-class electronic systems where on-chip capacity, I/O availability, and architecture-level capabilities (as described in the Stratix IV handbook) drive design choices. The combination of performance-oriented resources and RoHS compliance supports both prototype and production programs.
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