EP4SGX290NF45C4

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 17661952 291200 1932-BBGA, FCBGA

Quantity 99 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290NF45C4 – Stratix® IV GX FPGA, 291,200 logic elements, ~17.66 Mbits RAM, 920 I/Os, 1932‑BBGA

The EP4SGX290NF45C4 is an Intel Stratix IV GX field‑programmable gate array (FPGA) supplied in a 1932‑ball BGA package. It provides a high logic element count, substantial on‑chip memory, and a large I/O complement for designs that require significant programmable fabric and connectivity.

As a member of the Stratix IV GX device family, the device includes architecture elements described in the Stratix IV Device Handbook such as embedded memory, DSP resources, clocking/PLL structures, and high‑speed transceiver features, making it appropriate for high‑integration digital and data‑path applications within the device’s commercial operating range.

Key Features

  • Core and architecture — Stratix IV GX family device with 291,200 logic elements for complex programmable logic and control functions.
  • Embedded memory — Approximately 17.66 Mbits of on‑chip RAM to support buffering, packet processing, and intermediate data storage.
  • I/O and connectivity — 920 user I/Os to enable dense external interfacing and board‑level integration; the Stratix IV GX family includes high‑speed transceiver features documented in device handbook sections.
  • DSP and timing resources — Device handbook references indicate integrated DSP blocks, multiple clock networks and PLLs to support signal processing and precise clocking.
  • Power — Core supply range specified from 870 mV to 930 mV; designers can target the specified core voltage window for power planning.
  • Package and mounting — 1932‑BBGA FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) with surface‑mount assembly.
  • Operating range and compliance — Commercial grade device rated for 0 °C to 85 °C and RoHS compliant for lead‑free manufacturing processes.

Typical Applications

  • Communications and networking equipment — Use the large I/O count and Stratix IV GX transceiver capabilities to implement packet processing, interface aggregation, and protocol bridging.
  • High‑bandwidth data processing — Leverage 291,200 logic elements and approximately 17.66 Mbits of embedded memory for data path acceleration, buffering, and custom processing pipelines.
  • Video and imaging systems — Combine DSP resources, on‑chip RAM, and clocking structures for frame buffering, scaling, and real‑time image processing.
  • System integration and prototyping — Dense logic and I/O support on‑board integration and rapid iteration of complex digital subsystems within the commercial temperature range.

Unique Advantages

  • High logic capacity: 291,200 logic elements enable implementation of large, multi‑function FPGA designs without immediate partitioning across multiple devices.
  • Substantial embedded memory: Approximately 17.66 Mbits of on‑chip RAM reduces dependence on external memory for intermediate storage and buffering.
  • Extensive I/O resources: 920 I/Os provide flexibility for dense board‑level interconnects and multiple parallel interfaces.
  • Stratix IV GX feature set: Family‑level features listed in the device handbook — including DSP blocks, PLLs, clock networks, external memory interface support, and high‑speed transceiver features — support complex signal and data processing architectures.
  • Manufacturing and assembly friendly: 1932‑ball FCBGA in a surface‑mount form factor aligns with standard PCB assembly workflows.
  • Regulatory compliance: RoHS compliance supports lead‑free production requirements for commercial electronics.

Why Choose EP4SGX290NF45C4?

The EP4SGX290NF45C4 delivers a balance of high logic density, significant on‑chip memory, and a large number of I/Os in a single Stratix IV GX FPGA package. It is positioned for designs that require integrated DSP and clocking resources alongside flexible connectivity within a commercial operating window.

This device is suited to engineers and system designers implementing high‑integration digital subsystems — including communications, data processing, and imaging applications — who need substantial programmable resources and packaged manufacturability from the Stratix IV device family and accompanying device handbook documentation.

If you would like pricing, availability, or a formal quote for EP4SGX290NF45C4, please request a quote or submit your requirements and our team will respond with details and next steps.

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