EP4SGX290NF45I3G

The EP4SGX290NF45I3G is an Intel Stratix IV family FPGA organized for designs that require large programmable fabric and extensive I/O. It implements the Stratix IV GX device architecture and is offered in a 1932‑ball FCBGA package for surface‑mount assembly.

With approximately 291,200 logic elements, roughly 17.66 Mbits of embedded memory, and up to 920 I/O pins, this device targets applications demanding high integration density, significant on‑chip memory resources, and broad external connectivity. Operating voltage and environmental ranges support industrial deployment.

Key Features

• Large programmable fabric — Approximately 291,200 logic elements provide the capacity for complex custom logic, protocol stacks, and data-path implementations.
• Embedded memory — Approximately 17.66 Mbits of on‑chip RAM to support buffers, FIFOs, and local data storage without immediate external memory dependence.
• High I/O density — Up to 920 I/O pins for expansive peripheral and high‑speed interface connectivity.
• Stratix IV architecture features — Device family documentation highlights high‑speed transceiver features, DSP blocks, PLLs, and advanced clock networks suitable for high‑bandwidth and signal‑processing functions.
• Package and mounting — 1932‑ball FCBGA (45 × 45 mm) surface‑mount package for compact board-level integration.
• Power — Supported core supply range of 870 mV to 930 mV for the device core supply domain.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
• Regulatory — RoHS compliant.

Typical Applications

• High‑bandwidth communications — Implement protocol engines, aggregators, and interface bridges leveraging the device’s high I/O count and Stratix IV transceiver capabilities.
• Signal processing and DSP — Use embedded memory and DSP resources for fixed‑point filtering, data conditioning, and real‑time processing tasks.
• System integration and prototyping — Consolidate multiple functions (control, I/O, protocol logic) into a single programmable device to reduce system BOM and simplify board design.
• Industrial control and automation — Deploy in equipment requiring industrial temperature range and dense I/O for sensor, actuator, and fieldbus interfacing.

Unique Advantages

• High integration density: Approximately 291,200 logic elements enable consolidation of complex system functions onto a single device, reducing board count and interconnect complexity.
• Substantial on‑chip memory: Around 17.66 Mbits of embedded RAM supports large buffers and local data structures, lowering dependence on external memory.
• Extensive connectivity: Up to 920 I/O pins provide flexibility to interface with numerous peripherals, memory, and high‑speed links.
• Industrial robustness: –40 °C to 100 °C operating range and surface‑mount FCBGA packaging support deployment in demanding environments.
• Family ecosystem: Built on the Stratix IV device architecture with documented features such as high‑speed transceivers, DSP blocks, and advanced clocking to support complex designs.
• Regulatory compliance: RoHS compliant for environmental and supply‑chain compatibility.

Why Choose EP4SGX290NF45I3G?

The EP4SGX290NF45I3G positions itself as a high‑capacity Stratix IV GX FPGA intended for designs that require a large logic fabric, significant embedded memory, and broad I/O capability within an industrial temperature envelope. Its package and supply requirements are defined for board‑level integration where surface‑mount FCBGA solutions are preferred.

This device is well suited to engineers designing high‑bandwidth communication modules, compute‑intensive signal processing subsystems, and consolidated control platforms that benefit from on‑chip resources and the documented Stratix IV architecture features.

Request a quote or submit a request for pricing and availability to move your design forward with the EP4SGX290NF45I3G.