EP4SGX290NF45I4

The EP4SGX290NF45I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1932-BBGA (FCBGA) supplier package. It offers a high logic capacity and dense I/O suitable for demanding, high-throughput FPGA designs.

Built on the Stratix IV GX device family architecture documented in the device handbook, this industrial-grade FPGA is targeted at systems that require large programmable logic resources, significant embedded memory, and extensive I/O while operating across a wide temperature and voltage range.

Key Features

• High Logic Capacity — 291,200 logic elements for implementing large, complex designs and parallel processing architectures.
• Embedded Memory — Approximately 16.8 Mbits of on-chip RAM (17,661,952 bits) to support frame buffers, FIFOs, and local data storage.
• Extensive I/O — 920 I/O pins to interface with multiple peripherals, external memories, and high-density board-level connections.
• Package and Mounting — 1932-BBGA (FCBGA) supplier package, 1932-FBGA, FC (45×45) footprint; surface-mount device for compact, high-density board designs.
• Industrial Grade Operation — Rated for operation from −40 °C to 100 °C, suitable for systems that require extended temperature capability.
• Power Supply Range — Core voltage specified between 870 mV and 930 mV to match platform power-rail planning and sequencing.
• Standards and Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.
• Documented Architecture — Part of the Stratix IV GX family with device handbook references covering device core, I/O, transceiver, memory and DSP block details.

Typical Applications

• High-bandwidth communications — Use the Stratix IV GX architecture and extensive I/O to implement backplane interfaces, packet processing, and protocol bridging.
• Video and image processing — Large logic and on-chip RAM capacity enable frame buffering, parallel pixel pipelines, and real-time processing.
• High-performance compute acceleration — Implement DSP and custom compute engines that benefit from the device’s sizable logic and memory resources.
• Memory interface and bridging — Combine the device’s I/O density and embedded RAM to build memory controllers, bridges, and buffering subsystems.

Unique Advantages

• Substantial programmable capacity: 291,200 logic elements provide headroom for complex algorithms and extensive parallelism.
• Significant on-chip RAM: Approximately 16.8 Mbits of embedded memory reduces external memory dependence for intermediate storage and buffering.
• Large I/O complement: 920 I/O pins allow flexible interfacing to high-pin-count peripherals and multiple memory or transceiver lanes.
• Industrial operating range: Rated −40 °C to 100 °C to meet temperature requirements in industrial and rugged environments.
• Industry-standard packaging: 1932-BBGA / 1932-FBGA (45×45) package supports compact, high-density board layouts.
• Documented Stratix IV GX platform: Supported by the Stratix IV device handbook and related documentation for architecture-level design guidance.

Why Choose EP4SGX290NF45I4?

The EP4SGX290NF45I4 combines a large logic fabric, substantial embedded memory, and broad I/O capacity in an industrial-grade Stratix IV GX device. These attributes make it well suited for designers building high-throughput communication systems, video processing pipelines, and compute-acceleration modules that demand on-chip resources and dense board-level connectivity.

Backed by Intel’s Stratix IV documentation, the device provides a documented architecture and design guidance to support complex FPGA implementations while meeting extended temperature and RoHS requirements.

Request a quote or submit an inquiry for pricing and availability of EP4SGX290NF45I4 to evaluate it for your next high-performance FPGA design.