EP4SGX290NF45I3N

The EP4SGX290NF45I3N is a Stratix IV GX family FPGA in a 1932-BBGA FCBGA package, offered in an industrial grade configuration. It integrates a large logic fabric and on-chip memory with support for high-speed transceiver and I/O features described for the Stratix IV GX device family.

This device targets designs that require substantial logic density, extensive I/O, and robust system-level integration—delivering deterministic supply and operating ranges for industrial applications.

Key Features

• Logic Capacity — 291,200 logic elements and 11,648 CLBs provide extensive fabric resources for complex logic, control and processing functions.
• Embedded Memory — Approximately 17.66 Mbits of on-chip RAM (17,661,952 total RAM bits) for large buffering, packet storage, and on-chip data structures.
• I/O and Package — 920 user I/O pins in a 1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), with surface-mount mounting for dense board integration.
• Power Supply — Specified core voltage range of 870 mV to 930 mV to match system power domains and regulators.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial-environment deployments.
• Stratix IV GX Family Features — As a Stratix IV GX device, the part inherits family-level capabilities such as high-speed transceiver features, high aggregate data bandwidth, embedded DSP blocks, clock networks and PLLs, and advanced I/O features documented for the series.
• Compliance — RoHS compliant for environmental and assembly process requirements.

Typical Applications

• High-Bandwidth Communication Systems — Leverages Stratix IV GX family high-speed transceiver and aggregate bandwidth features to implement protocol endpoints and packet processing logic.
• Digital Signal Processing — Large logic and embedded memory capacity support DSP blocks and data-flow architectures for real-time signal processing tasks.
• Memory Interface Controllers — Extensive on-chip RAM and the family’s external memory interface features enable high-performance buffering and memory controller designs.
• System Integration and Prototyping — Dense I/O (920 pins) and the 1932-FBGA package simplify integration of multi-channel I/O and complex board-level prototypes.

Unique Advantages

• High Logic Density: 291,200 logic elements and 11,648 CLBs let you implement large, consolidated designs on a single device, reducing board-level complexity.
• Significant On-Chip Memory: Approximately 17.66 Mbits of RAM supports deep buffering and on-device data management without immediate external memory dependence.
• Extensive I/O Footprint: 920 I/O pins in a 1932-BBGA package provide flexibility for multi-channel connectivity and high-pin-count system interfaces.
• Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance suit industrial deployments and assembly processes.
• Family-Level System Features: Built on the Stratix IV GX architecture, the device benefits from documented transceiver, DSP, clocking and I/O capabilities for system-level designs.
• Compact Surface-Mount Packaging: The 1932-FBGA, FC (45×45) supplier package enables dense PCB layouts and scalable board integration.

Why Choose EP4SGX290NF45I3N?

The EP4SGX290NF45I3N combines substantial logic resources, large on-chip memory, and a high I/O count in an industrial-grade Stratix IV GX FPGA package. It is positioned for teams requiring consolidated logic and memory on a single device, with family-level transceiver and system integration capabilities documented in the Stratix IV GX device handbook.

Choose this device when your design demands high logic density, extensive embedded RAM, and a robust industrial operating range—supported by the Stratix IV GX architecture and a compact 1932-BBGA footprint for board-level integration.

Request a quote or submit an inquiry to receive pricing and availability for EP4SGX290NF45I3N tailored to your project requirements.