EP4SGX360FF35C2X

The EP4SGX360FF35C2X is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel. It provides a large programmable fabric with 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 564 I/O pins in a compact FCBGA package.

Engineered for designs that require high on-chip resource density and extensive I/O, this commercial‑grade device combines significant logic capacity, on‑chip RAM, and a surface‑mount 1152‑BBGA package to support complex integration on space‑constrained boards.

Key Features

• Programmable logic capacity 353,600 logic elements enable consolidation of complex digital functions within a single FPGA device.
• Embedded memory Approximately 23.1 Mbits of on‑chip RAM provide local storage for buffers, FIFOs, and state machines.
• High I/O count 564 I/O pins support broad interfacing options for peripherals, buses, and high‑density system connections.
• Power supply range Core voltage supply range of 870 mV to 930 mV for defined power design and sequencing.
• Package and mounting 1152‑BBGA (FCBGA) supplier device package, 35×35 mm footprint, optimized for surface‑mount assembly.
• Commercial operating range Rated for 0 °C to 85 °C operation and designated as commercial grade.
• RoHS compliant Manufactured in compliance with RoHS environmental requirements.

Typical Applications

• High‑density digital processing Use the large logic capacity and embedded memory to implement complex signal processing, protocol stacks, or custom compute pipelines on a single device.
• I/O‑intensive system integration The 564 I/O pins enable aggregation and routing of multiple interfaces, sensors, and peripherals without external multiplexing.
• Board‑level consolidation Combine logic, memory, and I/O in the 1152‑BBGA FCBGA package to reduce BOM count and save PCB area.

Unique Advantages

• Large on‑chip resources: 353,600 logic elements and approximately 23.1 Mbits of embedded RAM allow significant function integration and reduced external memory dependency.
• Extensive connectivity: 564 I/O pins give designers flexibility to support multiple interfaces and parallel connections without additional bridge components.
• Space‑efficient package: The 1152‑BBGA (35×35) FCBGA footprint offers a high‑density solution for compact system designs.
• Defined power window: Core voltage supply range of 870 mV to 930 mV simplifies power sequencing and design validation around a narrow operating range.
• Commercial temperature rating: Rated 0 °C to 85 °C for applications targeting commercial environments.
• Regulatory compliance: RoHS compliance supports environmentally conscious design and manufacturing requirements.

Why Choose EP4SGX360FF35C2X?

EP4SGX360FF35C2X delivers a combination of substantial logic density, significant embedded memory, and a high I/O count within a compact surface‑mount FCBGA package. Backed by Intel's Stratix IV GX family, this device is positioned for designs that need to consolidate complex digital functions and extensive interfaces into a single commercial‑grade FPGA.

Its on‑chip resources and package characteristics make it suitable for engineers seeking to reduce board complexity and integrate high levels of functionality while operating within a defined commercial temperature and power envelope.

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