EP4SGX360FF35C3N

The EP4SGX360FF35C3N is a Stratix® IV GX field programmable gate array (FPGA) IC offering high logic density and extensive I/O capability in a 1152-FBGA (35×35) FCBGA package. It is a member of the Stratix IV GX device family and is specified for commercial applications.

This device targets designs that require large programmable logic capacity, significant on-chip memory, and advanced I/O and transceiver capabilities as documented in the Stratix IV device handbook. Key hardware anchors include 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 564 user I/Os, making it suited to high-bandwidth communications, DSP workloads, and complex system integration where density and I/O count matter.

Key Features

• High-density logic fabric — 353,600 logic elements provide extensive programmable logic resources for large custom designs and complex functions.
• Embedded memory — Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage for compute- and memory-intensive designs.
• Large I/O count and package — 564 I/Os in a 1152-FBGA (35×35) FCBGA surface-mount package enable broad external connectivity and high pin count system implementations.
• Stratix IV GX architecture features — Device handbook listings include high-speed transceiver features, digital signal processing (DSP) blocks, PLLs and advanced clock networks, and external memory interface support.
• Core voltage range — Specified voltage supply between 870 mV and 930 mV for core power planning and regulator selection.
• Commercial temperature and grade — Commercial-grade device specified for an operating temperature range of 0°C to 85°C.
• Surface-mount package — 1152-BBGA FCBGA package optimized for high-density PCB layouts and automated assembly.
• RoHS compliant — Device is RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• High-speed communications and networking — Large logic capacity, documented high-speed transceiver features, and substantial I/O enable protocol implementation and packet processing for high-bandwidth links.
• Digital signal processing and accelerators — On-chip memory and DSP-oriented architecture elements documented in the device handbook make the device suitable for signal processing, filtering, and algorithm acceleration.
• Systems with external memory interfaces — Support for external memory interfaces and abundant I/Os allows implementation of systems that require large off-chip memory and complex memory controllers.
• Complex system integration — High logic density and extensive I/O are suited to consolidating multiple functions into a single programmable device for advanced embedded systems.

Unique Advantages

• Extensive programmable resources: 353,600 logic elements reduce the need for multiple devices by enabling large designs to fit on a single FPGA.
• Substantial on-chip RAM: Approximately 23.1 Mbits of embedded memory supports local buffering and accelerates data-path operations without immediate dependence on external RAM.
• High I/O count in a compact package: 564 I/Os in a 1152-FBGA (35×35) FCBGA provide flexible external connectivity while maintaining a manufacturable surface-mount footprint.
• Documented Stratix IV GX feature set: Device handbook coverage of transceivers, DSP blocks, PLLs, and clock networks helps engineers design to known architecture elements.
• Commercial temperature and RoHS compliance: Clear operating range (0°C to 85°C) and RoHS compliance simplify qualification for commercial product lines.

Why Choose EP4SGX360FF35C3N?

The EP4SGX360FF35C3N delivers a combination of high logic density, significant embedded memory, and a large I/O complement in a standardized FCBGA package. Its placement in the Stratix IV GX family and the features documented in the device handbook make it a practical choice for designers building high-bandwidth communication systems, DSP accelerators, and complex embedded platforms that require consolidated programmable logic.

For teams focused on scalable, high-capacity FPGA implementations, this device provides a documented architecture and the component-level specifications needed for power, thermal, and PCB planning. Its commercial-grade temperature range and RoHS compliance support integration into mainstream commercial products.

Request a quote or submit an inquiry to receive pricing and availability information for the EP4SGX360FF35C3N and to discuss how it fits your next high-density FPGA design.