EP4SGX360FF35C4G

The EP4SGX360FF35C4G is an FPGA device from the Stratix IV family designed for high-density, system-level integration. Built with a large logic fabric and substantial on-chip memory, it targets applications that require complex logic, high I/O count and advanced board-level integration.

This commercial‑grade, surface‑mount FCBGA package combines 353,600 logic elements with approximately 23.1 Mbits of embedded memory and 564 I/O pins, providing a platform for high-throughput communications, signal processing and system integration tasks.

Key Features

• Logic Capacity  353,600 logic elements to map large digital designs and complex control logic.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, packet storage and local data processing.
• I/O Density  564 user I/O pins to support wide external interfacing and multi-channel connectivity.
• Package & Mounting  1152‑FBGA (35×35) FCBGA package, surface mount, suitable for high‑density PCB layouts.
• Power Supply Range  Core supply specified between 870 mV and 930 mV to match targeted board power architectures.
• Operating Conditions  Commercial operating temperature range from 0 °C to 85 °C and RoHS compliant.
• Stratix IV Family Features  Family-level architecture includes embedded memory blocks, dedicated DSP resources, PLLs and advanced clock networks, plus high-speed transceiver and differential I/O capabilities as described in the Stratix IV device documentation.

Typical Applications

• High‑performance communications  Hardware implementation of protocol processing, packet buffering and interface bridging leveraging the device’s large logic and I/O count.
• Signal processing and compute acceleration  DSP-oriented designs that use abundant logic elements and on-chip RAM for real‑time data manipulation.
• High‑speed interface and bridging  Multi-channel I/O systems and external memory interface controllers that benefit from the device’s high I/O density and Stratix IV family I/O features.
• System integration and prototyping  Complex SoC prototyping, custom hardware control and board-level integration where dense logic and memory reduce external component count.

Unique Advantages

• Large logic fabric: 353,600 logic elements provide headroom for complex finite state machines, datapaths and custom accelerators.
• Significant on‑chip RAM: Approximately 23.1 Mbits of embedded memory reduces dependence on external memory for many buffering and caching tasks.
• High I/O count: 564 I/O pins enable broad connectivity for multi-lane interfaces, sensors and peripheral buses.
• Board‑level friendliness: 1152‑FBGA (35×35) package and surface‑mount construction simplify placement in dense PCB designs.
• Family feature set: Stratix IV family capabilities—such as DSP blocks, PLLs and high-speed differential I/O—allow designers to leverage documented architecture features for complex system requirements.
• Regulatory and assembly considerations: RoHS compliance and commercial-grade temperature rating streamline sourcing and manufacturing for mainstream electronic products.

Why Choose EP4SGX360FF35C4G?

The EP4SGX360FF35C4G positions itself as a high‑capacity Stratix IV FPGA option for designs that require a large logic count, substantial embedded memory and extensive I/O in a compact FCBGA footprint. Its family-level architecture supports advanced clocking, DSP and high-speed I/O features documented for Stratix IV devices, enabling designers to implement complex system functions on-chip.

This device suits engineering teams building communications equipment, signal processing hardware, high-density interface controllers and advanced prototypes that benefit from a scalable, well-documented FPGA family and commercial operating conditions.

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