EP4SGX360FF35I3G

The EP4SGX360FF35I3G is an Intel FPGA device based on the Stratix IV device family architecture. It delivers high logic capacity, significant embedded memory, and a large I/O count for complex, compute- and I/O-intensive designs.

Targeted at applications that require high aggregate data bandwidth, flexible protocol support and industrial-temperature operation, this device combines a Stratix IV GX–class architecture (as documented in the device handbook) with industrial-grade electrical and thermal specifications.

Key Features

• Core logic capacity — 353,600 logic elements to implement large, complex FPGA designs.
• Embedded memory — approximately 23.1 Mbits of on-chip RAM for buffering, frame storage, and local data processing.
• I/O resources — 564 user I/O pins to support wide peripheral and interface integration.
• High-speed transceiver architecture — built on the Stratix IV GX device family, which includes high-speed transceiver features described in the device handbook.
• External memory interface support — architecture and handbook documentation include external memory interface capabilities for high-bandwidth system designs.
• Package and mounting — 1152-ball FCBGA (1152-BBGA) in a 35 × 35 mm supplier device package; surface-mount mounting type for PCB assembly.
• Power supply — core supply range specified at 870 mV to 930 mV.
• Operating range and grade — industrial grade with operating temperature from −40 °C to 100 °C.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-bandwidth networking and communications — leverage large logic capacity and the Stratix IV GX transceiver architecture for protocol processing and data-path acceleration.
• Signal processing and DSP acceleration — on-chip memory and the device family’s DSP-oriented architecture support high-throughput signal and image processing tasks.
• Memory interface and storage controllers — device handbook–documented external memory interface support enables designs that require high aggregate memory bandwidth.
• Industrial control and measurement — industrial temperature rating and robust I/O count make the device suitable for demanding industrial systems and test equipment.

Unique Advantages

• High integration density: 353,600 logic elements reduce the need for multiple devices and simplify high-complexity implementations.
• Substantial on-chip RAM: approximately 23.1 Mbits of embedded memory enables larger local buffers and decreases external memory dependence.
• Extensive connectivity: 564 I/O pins support dense peripheral and interface connectivity, simplifying board-level integration.
• Industrial-ready operation: rated from −40 °C to 100 °C and specified as industrial grade for deployment in harsh environments.
• Documented architecture: based on the Stratix IV device family with comprehensive device handbook material for design guidance and system-level features.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing requirements.

Why Choose EP4SGX360FF35I3G?

The EP4SGX360FF35I3G positions itself for engineers and system designers who need a high-capacity FPGA with extensive I/O and substantial embedded memory, together with the architecture and documentation of the Stratix IV family. Its industrial temperature range and surface-mount FCBGA packaging make it suitable for deployed systems that must withstand challenging thermal environments.

This device is appropriate for complex communications, high-throughput signal processing, memory-interface-centric systems and industrial equipment where long-term design scalability and vendor documentation support are important considerations.

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