EP4SGX360FH29C2X
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 23105536 353600 780-BBGA, FCBGA |
|---|---|
| Quantity | 786 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 289 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360FH29C2X – Stratix® IV GX Field Programmable Gate Array (FPGA), 780-BBGA
The EP4SGX360FH29C2X is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for applications that require substantial on-chip logic and memory resources. It provides 353,600 logic elements and approximately 23.1 Mbits of embedded RAM to support complex digital designs.
This device features 289 user I/O in a 780-ball FCBGA package (supplier device package: 780-HBGA, 33×33), a low-voltage core supply range of 0.870–0.930 V, and is specified for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant and intended for surface-mount assembly.
Key Features
- Core Logic Provides 353,600 logic elements suitable for large-scale digital implementations and complex programmable logic.
- Embedded Memory Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive functions.
- I/O and Packaging 289 user I/O pins in a 780-BBGA (FCBGA) footprint; supplier device package listed as 780-HBGA (33×33). Designed for surface-mount mounting.
- Power Core voltage supply range of 0.870 V to 0.930 V to match system power-rail requirements.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental regulatory requirements.
Unique Advantages
- Large logic capacity: 353,600 logic elements enable integration of substantial digital functions into a single FPGA, reducing external component count.
- Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM supports data buffering and state storage without relying on external memory devices.
- High I/O density: 289 user I/O pins in a compact 780-ball FCBGA package accommodate complex board-level connectivity and dense interfaces.
- Low-voltage core operation: Core supply specified from 0.870 V to 0.930 V supports modern low-voltage system designs and power-optimized architectures.
- RoHS compliant: Meets RoHS requirements for lead-free assembly and broader regulatory acceptance.
Why Choose EP4SGX360FH29C2X?
The EP4SGX360FH29C2X is positioned for designers who need substantial programmable logic, abundant embedded memory, and a high I/O count in a single commercial-grade FCBGA package. Its combination of 353,600 logic elements and approximately 23.1 Mbits of on-chip RAM enables consolidation of complex functions and reduces external BOM.
With a low-voltage core supply range and RoHS compliance, this FPGA is suited to commercial temperature applications that require a balance of density, integration, and regulatory readiness. Use this device when your design requires a high-capacity, surface-mount FPGA solution in a 780-ball package.
Request a quote today to check pricing and availability for EP4SGX360FH29C2X or to submit a procurement inquiry.

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