EP4SGX360FH29C2X

IC FPGA 289 I/O 780HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 23105536 353600 780-BBGA, FCBGA

Quantity 786 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O289Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360FH29C2X – Stratix® IV GX Field Programmable Gate Array (FPGA), 780-BBGA

The EP4SGX360FH29C2X is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for applications that require substantial on-chip logic and memory resources. It provides 353,600 logic elements and approximately 23.1 Mbits of embedded RAM to support complex digital designs.

This device features 289 user I/O in a 780-ball FCBGA package (supplier device package: 780-HBGA, 33×33), a low-voltage core supply range of 0.870–0.930 V, and is specified for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant and intended for surface-mount assembly.

Key Features

  • Core Logic  Provides 353,600 logic elements suitable for large-scale digital implementations and complex programmable logic.
  • Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive functions.
  • I/O and Packaging  289 user I/O pins in a 780-BBGA (FCBGA) footprint; supplier device package listed as 780-HBGA (33×33). Designed for surface-mount mounting.
  • Power  Core voltage supply range of 0.870 V to 0.930 V to match system power-rail requirements.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental regulatory requirements.

Unique Advantages

  • Large logic capacity: 353,600 logic elements enable integration of substantial digital functions into a single FPGA, reducing external component count.
  • Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM supports data buffering and state storage without relying on external memory devices.
  • High I/O density: 289 user I/O pins in a compact 780-ball FCBGA package accommodate complex board-level connectivity and dense interfaces.
  • Low-voltage core operation: Core supply specified from 0.870 V to 0.930 V supports modern low-voltage system designs and power-optimized architectures.
  • RoHS compliant: Meets RoHS requirements for lead-free assembly and broader regulatory acceptance.

Why Choose EP4SGX360FH29C2X?

The EP4SGX360FH29C2X is positioned for designers who need substantial programmable logic, abundant embedded memory, and a high I/O count in a single commercial-grade FCBGA package. Its combination of 353,600 logic elements and approximately 23.1 Mbits of on-chip RAM enables consolidation of complex functions and reduces external BOM.

With a low-voltage core supply range and RoHS compliance, this FPGA is suited to commercial temperature applications that require a balance of density, integration, and regulatory readiness. Use this device when your design requires a high-capacity, surface-mount FPGA solution in a 780-ball package.

Request a quote today to check pricing and availability for EP4SGX360FH29C2X or to submit a procurement inquiry.

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