EP4SGX360FH29C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 4 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 289 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360FH29C3G – * Field Programmable Gate Array (FPGA) IC
The EP4SGX360FH29C3G is a Field Programmable Gate Array (FPGA) IC from Intel, built on the Stratix IV device family architecture. It provides a high-capacity programmable fabric and system-level features suitable for high-throughput, protocol-rich applications.
With large logic capacity, substantial on-chip memory and extensive I/O, this device targets commercial designs that require programmable signal processing, high aggregate data bandwidth, and flexible external memory interfacing while operating within a commercial temperature range.
Key Features
- Core Logic Capacity — 353,600 logic elements for complex, high-density logic implementations and wide-ranging programmable functions.
- Embedded Memory — Approximately 23 Mbits of embedded memory (23,105,536 total RAM bits) to support large buffering, on-chip data storage and memory-intensive designs.
- I/O and Connectivity — 289 user I/Os to support diverse peripheral connections and external interfaces; the Stratix IV family includes high-speed transceiver features and high-speed differential I/O capabilities.
- Signal Processing and System Blocks — Architecture includes digital signal processing (DSP) blocks, PLLs and flexible clock networks for deterministic timing and complex arithmetic acceleration.
- External Memory and Protocol Support — Designed to support external memory interfaces and a wide range of protocol implementations as described for the Stratix IV family.
- Power and Core Voltage — Core voltage range of 870 mV to 930 mV to match system power rails and design constraints.
- Package and Mounting — Surface-mount FCBGA package (780-BBGA); supplier device package listed as 780-HBGA (33×33) for compact, board-level integration.
- Commercial Grade and Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
- Compliance — RoHS compliant for environmental and assembly considerations.
Typical Applications
- Networking and Communications — Implement protocol processing and high-bandwidth data paths using the device’s large logic capacity, high-speed transceiver features, and extensive I/O.
- Digital Signal Processing — Deploy DSP-intensive functions and custom signal chains using on-chip DSP blocks and the device’s substantial embedded memory.
- External Memory Interfaces — Act as a programmable controller or bridge for external memory systems, leveraging the Stratix IV family’s external memory interface support.
- High-performance Embedded Systems — Integrate complex custom logic, timing-critical functions and flexible I/O in compute-accelerated embedded designs within commercial temperature environments.
Unique Advantages
- High Logic Density: 353,600 logic elements enable large-scale integration of custom logic and state machines on a single device, reducing system complexity.
- Significant On-chip Memory: Approximately 23 Mbits of embedded RAM supports deep buffering and local data storage, reducing dependence on external memory for many tasks.
- Extensive I/O Count: 289 I/Os provide flexibility for multi-channel interfaces, peripheral mixing and board-level routing options.
- Stratix IV System Features: Built on the Stratix IV device family architecture, with documented support for high-speed transceivers, DSP blocks, PLLs and robust clock networks to address high-bandwidth designs.
- Compact, Surface-mount Package: 780-ball FCBGA (780-BBGA) in a 33×33 supplier package offers a compact footprint for dense PCB layouts.
- Commercial-grade Operating Range: Rated for 0 °C to 85 °C to meet standard commercial deployment requirements.
Why Choose EP4SGX360FH29C3G?
The EP4SGX360FH29C3G combines large programmable logic resources, substantial embedded memory and extensive I/O in a Stratix IV family FPGA intended for commercial, high-bandwidth applications. Its architecture supports DSP acceleration, sophisticated clocking and high-speed connectivity, enabling designers to implement complex algorithms and protocol stacks on a single device.
This device is well suited for engineering teams building bandwidth- and compute-intensive systems that require on-chip memory, flexible I/O, and the Stratix IV family’s system-level features. The commercial-grade temperature range and RoHS compliance make it appropriate for mainstream deployed products and board-level integration.
If you would like pricing or availability, request a quote or submit a procurement inquiry to receive a formal quotation and lead-time information.

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