EP4SGX360FH29C4

The EP4SGX360FH29C4 is a Stratix IV GX family FPGA from Intel, implemented in a 780-ball BGA package. The device integrates a large FPGA fabric and on‑chip memory suitable for designs that require substantial logic capacity and high I/O density.

As a Stratix IV GX device, the part aligns with family-level features such as high‑speed transceivers, extensive embedded memory, DSP resources and a broad set of I/O capabilities, making it appropriate for applications that need high aggregate data bandwidth and protocol support.

Key Features

• Logic Capacity  353,600 logic elements provide substantial programmable fabric for complex logic, control and datapath implementations.
• Embedded Memory  Approximately 23.1 Mbits of on‑chip RAM to support large buffering, packet memory or algorithm state storage.
• I/O Density  289 I/O pins to support wide external interfacing and dense board-level connectivity.
• Stratix IV GX Family Capabilities  Family-level features include high‑speed transceivers, DSP blocks, PLLs and extensive I/O features for protocol support and signal integrity (as described in the Stratix IV device handbook).
• Package and Mounting  780-BBGA (FCBGA) assembly; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type.
• Power  Voltage supply range specified at 0.870 V to 0.930 V for device core operation.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C, grade: Commercial.
• Regulatory  RoHS compliant.

Typical Applications

• High‑speed communications  Implement protocol engines and high‑aggregate bandwidth interfaces using the Stratix IV GX family transceiver and I/O capabilities.
• Network and packet processing  Use abundant logic elements and on‑chip RAM for packet buffering, classification and forwarding functions.
• DSP and signal processing  Leverage the family’s DSP resources and large embedded memory for real‑time processing tasks and algorithm acceleration.
• Complex embedded systems  Integrate control, data‑path and custom logic in a single device with high I/O count for broad sensor or peripheral connectivity.

Unique Advantages

• Large programmable fabric: 353,600 logic elements enable complex designs and substantial parallelism without external logic.
• Significant on‑chip memory: Approximately 23.1 Mbits of embedded RAM reduce dependency on external memory for many buffering and state storage needs.
• High I/O count: 289 I/O pins provide flexible interfacing options and support for wide buses or multiple serial lanes.
• Family-level high-speed features: Stratix IV GX family features such as high‑speed transceivers and DSP blocks support high‑bandwidth and protocol‑rich designs.
• Compact BGA package: 780-ball BGA (supplier package 780‑HBGA 33×33) delivers high integration density for space‑constrained PCBs.
• Commercial temperature and RoHS compliant: Designed for commercial deployments with RoHS compliance for environmental considerations.

Why Choose EP4SGX360FH29C4?

EP4SGX360FH29C4 positions itself as a high‑capacity Stratix IV GX FPGA offering substantial logic elements, sizable embedded memory and significant I/O resources in a 780‑ball BGA package. Its family heritage includes features aimed at high‑bandwidth and protocol‑rich implementations, making the device suitable for demanding communications, networking, DSP and embedded system designs.

The combination of logic density, on‑chip RAM and I/O capability provides a scalable platform for engineering teams looking to consolidate functions, manage board-level complexity and deliver robust programmable solutions within a commercial temperature range.

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