EP4SGX360FH29C3
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 23105536 353600 780-BBGA, FCBGA |
|---|---|
| Quantity | 74 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 289 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360FH29C3 – Stratix IV GX FPGA, 353,600 logic elements, 780-BBGA (FCBGA)
The EP4SGX360FH29C3 is a Stratix IV GX field-programmable gate array (FPGA) from Intel, providing a high-density programmable fabric built on the Stratix IV family architecture. It combines a large logic capacity, substantial on-chip embedded memory, and a high I/O count in a 780-ball BGA package for commercial-grade designs.
Designed for applications that require high aggregate bandwidth and extensive logic and memory resources, this device is positioned for complex data-path processing, I/O-intensive systems, and designs that leverage Stratix IV GX device family features such as high-speed transceiver support documented in the device handbook.
Key Features
- High Logic Capacity — 353,600 logic elements provide extensive programmable fabric for large designs and complex algorithms.
- Embedded Memory — Approximately 23.1 Mbits of on-chip RAM (23,105,536 total RAM bits) for data buffering, FIFOs, and state storage close to logic.
- High I/O Count — 289 user I/O pins to support multiple external interfaces and parallel connectivity requirements.
- Stratix IV GX Architecture — Device family features and high-speed transceiver capabilities as described in the Stratix IV device handbook enable high aggregate data bandwidth and a wide range of protocol support.
- Power Supply Range — Core supply specified from 870 mV to 930 mV for system power planning and supply design.
- Package and Mounting — 780-BBGA (FCBGA) package, supplier device package listed as 780-HBGA (33×33), designed for surface-mount assembly.
- Commercial Grade and Temperature Range — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
- RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and environmental compliance.
Typical Applications
- High-bandwidth communications — Use the Stratix IV GX architecture and high-speed transceiver features for designs that require substantial aggregate data throughput and protocol flexibility.
- Data-path and signal processing — Large logic capacity and approximately 23.1 Mbits of embedded memory allow implementation of complex DSP pipelines, buffering, and real-time processing.
- I/O-intensive system controllers — With 289 I/O pins, the device supports multi-channel interfaces, parallel peripherals, and complex system integration tasks.
- Prototype and commercial designs — Commercial-grade temperature rating and surface-mount 780-BBGA package support production deployments within commercial operating environments.
Unique Advantages
- Large programmable fabric: 353,600 logic elements let you implement complex logic and integration of multiple subsystems on a single device.
- Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces external memory dependency and shortens data paths for lower latency.
- High I/O density: 289 I/O pins enable extensive external connectivity without additional interface chips, simplifying board-level design.
- Family-level transceiver support: Stratix IV GX device features documented in the device handbook provide a foundation for high aggregate bandwidth and broad protocol support.
- Compact surface-mount package: 780-ball BGA package (supplier: 780-HBGA 33×33) balances high integration density with standard PCB assembly processes.
- Regulatory hygiene: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose EP4SGX360FH29C3?
The EP4SGX360FH29C3 combines high logic density, substantial embedded memory, and a large I/O complement in a Stratix IV GX FPGA form factor suitable for commercial applications. Its documented family features for high-speed transceivers and aggregate data bandwidth make it a fit for designs that need to consolidate complex processing and heavy I/O into a single programmable device.
This device is ideal for teams developing bandwidth- and logic-intensive systems where on-chip memory, I/O density, and compatibility with Stratix IV GX architecture features contribute to a scalable and maintainable design approach.
Request a quote or submit an inquiry to obtain pricing and availability for EP4SGX360FH29C3 and to discuss how this device can meet your design requirements.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018