EP4SGX360FH29C3

IC FPGA 289 I/O 780HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 23105536 353600 780-BBGA, FCBGA

Quantity 74 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O289Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360FH29C3 – Stratix IV GX FPGA, 353,600 logic elements, 780-BBGA (FCBGA)

The EP4SGX360FH29C3 is a Stratix IV GX field-programmable gate array (FPGA) from Intel, providing a high-density programmable fabric built on the Stratix IV family architecture. It combines a large logic capacity, substantial on-chip embedded memory, and a high I/O count in a 780-ball BGA package for commercial-grade designs.

Designed for applications that require high aggregate bandwidth and extensive logic and memory resources, this device is positioned for complex data-path processing, I/O-intensive systems, and designs that leverage Stratix IV GX device family features such as high-speed transceiver support documented in the device handbook.

Key Features

  • High Logic Capacity — 353,600 logic elements provide extensive programmable fabric for large designs and complex algorithms.
  • Embedded Memory — Approximately 23.1 Mbits of on-chip RAM (23,105,536 total RAM bits) for data buffering, FIFOs, and state storage close to logic.
  • High I/O Count — 289 user I/O pins to support multiple external interfaces and parallel connectivity requirements.
  • Stratix IV GX Architecture — Device family features and high-speed transceiver capabilities as described in the Stratix IV device handbook enable high aggregate data bandwidth and a wide range of protocol support.
  • Power Supply Range — Core supply specified from 870 mV to 930 mV for system power planning and supply design.
  • Package and Mounting — 780-BBGA (FCBGA) package, supplier device package listed as 780-HBGA (33×33), designed for surface-mount assembly.
  • Commercial Grade and Temperature Range — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

  • High-bandwidth communications — Use the Stratix IV GX architecture and high-speed transceiver features for designs that require substantial aggregate data throughput and protocol flexibility.
  • Data-path and signal processing — Large logic capacity and approximately 23.1 Mbits of embedded memory allow implementation of complex DSP pipelines, buffering, and real-time processing.
  • I/O-intensive system controllers — With 289 I/O pins, the device supports multi-channel interfaces, parallel peripherals, and complex system integration tasks.
  • Prototype and commercial designs — Commercial-grade temperature rating and surface-mount 780-BBGA package support production deployments within commercial operating environments.

Unique Advantages

  • Large programmable fabric: 353,600 logic elements let you implement complex logic and integration of multiple subsystems on a single device.
  • Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces external memory dependency and shortens data paths for lower latency.
  • High I/O density: 289 I/O pins enable extensive external connectivity without additional interface chips, simplifying board-level design.
  • Family-level transceiver support: Stratix IV GX device features documented in the device handbook provide a foundation for high aggregate bandwidth and broad protocol support.
  • Compact surface-mount package: 780-ball BGA package (supplier: 780-HBGA 33×33) balances high integration density with standard PCB assembly processes.
  • Regulatory hygiene: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose EP4SGX360FH29C3?

The EP4SGX360FH29C3 combines high logic density, substantial embedded memory, and a large I/O complement in a Stratix IV GX FPGA form factor suitable for commercial applications. Its documented family features for high-speed transceivers and aggregate data bandwidth make it a fit for designs that need to consolidate complex processing and heavy I/O into a single programmable device.

This device is ideal for teams developing bandwidth- and logic-intensive systems where on-chip memory, I/O density, and compatibility with Stratix IV GX architecture features contribute to a scalable and maintainable design approach.

Request a quote or submit an inquiry to obtain pricing and availability for EP4SGX360FH29C3 and to discuss how this device can meet your design requirements.

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