EP4SGX360FH29C4G

IC FPGA 289 I/O 780HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 632 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O289Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360FH29C4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX360FH29C4G is an Intel (Altera) Stratix IV–family Field Programmable Gate Array designed for demanding, high-density FPGA implementations. It provides a large programmable fabric, substantial on‑chip memory, and extensive I/O in a compact BGA package.

This device is suited for designs that require high logic capacity, significant embedded memory, and a broad set of I/O options within commercial temperature and power envelopes.

Key Features

  • High logic capacity — 353,600 logic elements to implement complex digital functions and large-scale designs.
  • Embedded memory — approximately 23 Mbits of on‑chip RAM for buffering, frame storage, and intermediate data processing.
  • Extensive I/O — 289 user I/O pins to support multiple interfaces and board-level connectivity.
  • Stratix IV architecture — device handbook references architecture features such as embedded memory, DSP blocks, PLLs, and high-speed transceiver capabilities within the Stratix IV family.
  • Power supply range — core voltage specified from 870 mV to 930 mV for the programmable fabric.
  • Commercial operating range — rated for 0 °C to 85 °C operation for standard commercial applications.
  • Package and mounting — surface-mount FCBGA package in a 780-ball HBGA footprint (supplier device package: 780‑HBGA, 33×33 mm nominal).
  • Regulatory compliance — RoHS-compliant device.

Typical Applications

  • High‑performance signal processing — leverage the device’s large logic density and embedded memory for complex DSP and real‑time data manipulation.
  • Networking and communications — use the Stratix IV family’s transceiver and high‑bandwidth architecture references to implement protocol engines and packet processing.
  • Video and imaging systems — on‑chip RAM and abundant logic elements support frame buffering, scaling, and processing pipelines.

Unique Advantages

  • High logic density: 353,600 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing system complexity.
  • Substantial on‑chip memory: approximately 23 Mbits of embedded RAM minimizes the need for external memory in many buffering and processing tasks.
  • Generous I/O count: 289 I/Os allow flexible interfacing to peripherals, memory, and board-level signals without additional multiplexing hardware.
  • Compact BGA footprint: 780‑ball HBGA (33×33) surface-mount package enables high integration density on modern PCBs.
  • Commercial temperature rating: 0 °C to 85 °C supports a wide range of standard electronic products.
  • RoHS compliant: meets common environmental and manufacturing requirements for lead‑free assembly.

Why Choose EP4SGX360FH29C4G?

The EP4SGX360FH29C4G positions itself as a high‑capacity, commercially graded Stratix IV FPGA option for designs that demand a large programmable fabric, ample embedded memory, and broad I/O without sacrificing board‑level density. Its combination of 353,600 logic elements, approximately 23 Mbits of RAM, and 289 I/Os makes it suitable for consolidating complex subsystems into a single programmable device.

Choose this device when you need a scalable Stratix IV–family FPGA with a compact FCBGA footprint, defined core voltage range, and commercial operating temperature—delivering a balanced platform for high‑density digital, signal processing, and networking applications.

Request a quote or submit an inquiry to get pricing and lead‑time information for EP4SGX360FH29C4G. Our team can provide availability details and assist with part selection for your design requirements.

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