EP4SGX360FH29I3N

The EP4SGX360FH29I3N is a Stratix® IV GX field programmable gate array (FPGA) offering 353,600 logic elements and approximately 23 Mbits of embedded memory. It provides 289 user I/O and is supplied in a 780-ball FCBGA package (780-HBGA, 33×33) for surface-mount assembly.

Designed for industrial-grade operation, the device supports a supply voltage range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require substantial on-chip logic and memory within a high-pin-count package.

Key Features

• Core Logic  353,600 logic elements provide a large programmable fabric for complex logic and custom processing blocks.
• Embedded Memory  Approximately 23 Mbits of on-chip RAM to implement buffers, FIFOs, and algorithmic storage directly in the FPGA.
• I/O Capacity  289 user I/O pins accommodate multiple interfaces and high-pin-count connectivity requirements.
• Package & Mounting  780-ball FCBGA (supplier package: 780-HBGA, 33×33) in a surface-mount form factor for compact board-level integration.
• Power Supply Range  Operates from 870 mV to 930 mV, enabling integration with systems designed around low-voltage core rails.
• Operating Temperature  Industrial temperature range from −40 °C to 100 °C for deployment in temperature-variable environments.
• Regulatory Compliance  RoHS-compliant to support environmentally conscious manufacturing and assembly processes.

Typical Applications

• Network and Communications Equipment  Use the device where large logic capacity and extensive I/O are needed to implement packet processing, protocol bridging, or custom interface logic.
• Data Processing and Acceleration  Deploy embedded memory and abundant logic elements for on-chip buffering, custom datapaths, and hardware acceleration tasks.
• Industrial Control Systems  Leverage the industrial operating temperature range and high I/O count for complex control, sensor aggregation, and real-time processing.

Unique Advantages

• Large Programmable Fabric: 353,600 logic elements enable extensive custom logic and integration of multiple functions into a single device, reducing system BOM.
• Significant On-Chip Memory: Approximately 23 Mbits of embedded RAM provides local storage for buffering and stateful processing without external memory.
• High I/O Count: 289 user I/O simplify board-level routing for multi-interface designs and high-pin-count subsystems.
• Compact, Surface-Mount Package: 780-ball FCBGA (33×33) offers a high-density package for space-constrained PCBs while supporting robust board-level integration.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, suitable for deployments requiring wider operating temperature tolerance.
• RoHS Compliance: Supports environmentally compliant manufacturing workflows.

Why Choose EP4SGX360FH29I3N?

The EP4SGX360FH29I3N positions itself as a high-capacity Stratix IV GX FPGA suitable for designs that demand large programmable logic resources, on-chip memory, and substantial I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for systems requiring robust environmental tolerance and regulatory alignment.

This device is well suited for engineering teams building complex, integrated FPGA-based solutions where consolidating functionality onto a single programmable device reduces board-level complexity and supports scalable, long-term deployments.

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