EP4SGX360FH29I4N

The EP4SGX360FH29I4N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 780-BBGA FCBGA package. It delivers high logic capacity and on-chip memory in a surface-mount package targeted at industrial-grade applications.

With 353,600 logic elements and approximately 23.1 Mbits of embedded memory, this device provides significant resources for complex digital designs while supporting a wide I/O count and industrial temperature operation.

Key Features

• Logic Capacity 353,600 logic elements for large-scale, configurable digital logic implementations.
• Embedded Memory Approximately 23.1 Mbits of on-chip RAM to support data buffering, state storage, and custom memory structures.
• I/O Resources 289 device I/O pins to accommodate extensive peripheral interfacing and board-level connectivity.
• Power Domain Core voltage supply range of 870 mV to 930 mV, enabling defined low-voltage operation parameters for power budgeting.
• Package and Mounting 780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33) with surface-mount mounting for compact board integration.
• Temperature and Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Manufacturer Produced by Intel, providing a known supply source for FPGA silicon.

Unique Advantages

• High logic density: 353,600 logic elements enable implementation of large, complex designs without immediate need for multi-device partitioning.
• Substantial on-chip RAM: Approximately 23.1 Mbits of embedded memory reduces dependence on off-chip memory for many buffering and storage tasks.
• Extensive I/O capability: 289 I/O pins support broad peripheral connectivity and complex system integration on a single device.
• Industrial temperature range: Rated from −40 °C to 100 °C to support applications requiring extended thermal tolerance.
• Compact surface-mount package: 780-BBGA FCBGA (780-HBGA, 33×33) offers a dense footprint for space-constrained board layouts.
• Defined low-voltage core: 870 mV to 930 mV supply range allows precise power planning for low-voltage designs.

Why Choose EP4SGX360FH29I4N?

The EP4SGX360FH29I4N positions itself as a high-capacity Stratix IV GX FPGA option for designs requiring substantial logic resources, embedded memory, and a large I/O complement within an industrial temperature-rated package. Its combination of 353,600 logic elements and approximately 23.1 Mbits of on-chip RAM supports complex, resource-intensive implementations.

Engineers and procurement teams seeking a surface-mount, industrial-grade FPGA with a compact 780-BBGA footprint and defined low-voltage core supply will find this device suitable for dense digital designs requiring robust operating-temperature margins.

If you would like pricing, availability, or a formal quote for EP4SGX360FH29I4N, request a quote or contact sales to discuss options and lead times.