EP4SGX360FH29I4G

The EP4SGX360FH29I4G is an Intel Stratix IV–family Field Programmable Gate Array packaged in a 780‑pin FCBGA (780‑HBGA, 33×33) surface‑mount package. It delivers a high logic capacity FPGA fabric with a rich set of device‑level features from the Stratix IV handbook, including high‑speed transceiver capability and on‑chip memory.

Designed for high‑bandwidth systems and industrial environments, the device targets applications that require large numbers of logic elements, substantial embedded memory, extensive I/O, and operation across an industrial temperature range.

Key Features

• Core Logic — 353,600 logic elements supporting complex programmable logic implementations and high integration of custom digital functions.
• Embedded Memory — Approximately 23.11 Mbits of on‑chip RAM enabling large buffering, packet handling, or local storage for processing pipelines.
• I/O Density — 289 user I/O pins to support broad external connectivity and multiple interface standards.
• Stratix IV Architecture Features — Includes family features documented in the Stratix IV device handbook such as high‑speed transceiver features, digital signal processing (DSP) blocks, PLLs, and extensive clock networks.
• Package and Mounting — 780‑BBGA / FCBGA package (supplier device package noted as 780‑HBGA, 33×33) with surface‑mount assembly for compact board designs.
• Power — Core voltage supply range 870 mV to 930 mV to support the device’s internal power domain requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.
• Regulatory — RoHS compliant.

Typical Applications

• High‑Speed Communications and Networking — Leverage Stratix IV transceiver and high logic density for packet processing, protocol bridging, and line‑rate interfaces.
• Signal Processing and DSP — Use the device’s substantial logic resources and on‑chip memory for real‑time DSP pipelines and algorithm acceleration.
• External Memory Interfaces and Bridging — Implement complex external memory controllers and interface logic using the available logic elements and I/O resources.
• Industrial Control and Instrumentation — Industrial temperature rating and robust packaging make the device suitable for industrial automation, test, and measurement systems.

Unique Advantages

• High integration density: 353,600 logic elements and approximately 23.11 Mbits of embedded memory reduce the need for external logic and memory components.
• Extensive I/O: 289 I/O pins provide broad connectivity options, simplifying multi‑lane or multi‑interface board designs.
• Stratix IV family capabilities: Access to device‑level features such as high‑speed transceivers, DSP blocks, PLLs, and advanced clock networks for complex system requirements.
• Industrial robustness: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial applications with environmental demands.
• Compact, surface‑mount package: 780‑HBGA (33×33) FCBGA footprint enables dense PCB layouts and automated assembly.
• Controlled core supply range: 870–930 mV core voltage specification aids in power budgeting and regulator selection for the FPGA core domain.

Why Choose EP4SGX360FH29I4G?

The EP4SGX360FH29I4G combines a high logic element count, significant embedded memory, and a substantial I/O complement within the Stratix IV device family architecture. Its blend of on‑chip resources and family features such as high‑speed transceivers and DSP capabilities makes it well suited for designers building high‑bandwidth, compute‑intensive, or industrial‑grade systems.

Choose this device when your design requires scalable logic capacity, ample local memory, and reliable operation across extended temperature ranges—backed by the Stratix IV device handbook documentation for architecture and system integration guidance.

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