EP4SGX360HF35C2N

The EP4SGX360HF35C2N is a Stratix® IV GX field programmable gate array (FPGA) from Intel designed for high-density, programmable logic implementations. This commercial-grade, surface-mount FCBGA device integrates 353,600 logic elements and 564 I/O pins with approximately 23 Mbits of embedded memory to support complex digital designs.

Engineered for applications requiring large on-chip logic capacity and extensive I/O, the device operates on a core supply range of 870 mV to 930 mV and supports an ambient operating temperature range of 0 °C to 85 °C. The package is a 1152-ball BGA (1152-FBGA, 35×35) intended for compact, high-density board layouts.

Key Features

• Core Logic  Provides 353,600 logic elements for implementing large-scale programmable logic and complex state machines.
• Embedded Memory  Approximately 23 Mbits of on-chip RAM to support buffering, lookup tables, and memory-mapped functions without external memory in many use cases.
• I/O Density  564 general-purpose I/O pins to accommodate broad connectivity and interface requirements across multiple peripherals and subsystems.
• Power  Core supply voltage range of 870 mV to 930 mV to match low-voltage FPGA power architectures and provide predictable supply requirements for system power design.
• Package & Mounting  1152-ball BGA package (1152-FBGA, 35×35) in a surface-mount FCBGA footprint for compact, high-density PCB integration.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant for global lead-free manufacturing requirements.

Unique Advantages

• High logic capacity: 353,600 logic elements enable implementation of sizable designs and large custom functions without immediate need for multiple devices.
• Significant on-chip memory: Approximately 23 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O resources: 564 I/O pins provide flexibility for interfacing with numerous peripherals, sensors, and external logic blocks.
• Compact, manufacturable package: 1152-ball FCBGA (35×35) supports dense PCB layouts while maintaining a surface-mount assembly process.
• Predictable power envelope: Defined core voltage range (870–930 mV) simplifies power-supply selection and thermal consideration during system design.
• Commercial-grade suitability: Rated for 0–85 °C operation for typical commercial and industrial-adjacent applications where that temperature range is appropriate.

Why Choose EP4SGX360HF35C2N?

The EP4SGX360HF35C2N positions itself as a high-density, commercially graded FPGA option for designers who need substantial on-chip logic, memory, and I/O capacity in a compact BGA package. Its combination of 353,600 logic elements, roughly 23 Mbits of embedded RAM, and 564 I/O pins makes it appropriate for complex digital systems that require significant programmable resources.

Backed by Intel manufacturing, this device offers a clear specification set—power, package, thermal, and environmental compliance—that supports confident integration into production designs where commercial temperature range and surface-mount assembly are required.

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