EP4SGX360HF35C3G

The EP4SGX360HF35C3G is a Stratix IV family FPGA offered in a high-density FCBGA package. It provides large programmable logic capacity, substantial embedded memory, and broad I/O resources for demanding digital designs.

Typical targets include high-performance digital signal processing, protocol bridging and transceiver-based systems, and complex custom logic where logic density, on-chip RAM and extensive I/O are primary requirements.

Key Features

• Core Logic — 353,600 logic elements (cells) delivering large programmable fabric for complex logic and datapath implementations.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM (23,105,536 total RAM bits) to support buffering, FIFOs and local data storage.
• I/O Capacity — 564 I/O pins to support wide external connectivity, multiple interfaces and high-channel-count designs.
• Series-Level Fabric and I/O Features — The Stratix IV Device Handbook documents architecture features including high-speed transceiver support, embedded DSP blocks, PLLs and clock networks, and high-speed differential I/O with DPA and Soft-CDR.
• Package and Mounting — Available in a 1152-FBGA (35×35) supplier package and 1152-BBGA FCBGA package in a surface-mount form factor for compact board integration.
• Power — Core voltage supply range of 870 mV to 930 mV, enabling defined power budgeting for system-level power design.
• Grade and Temperature — Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-performance networking — Large logic capacity and extensive I/O make the device suitable for packet processing, switching fabric and protocol handling in networking equipment.
• High-speed serial links and protocol bridging — Series documentation highlights high-speed transceiver features and wide protocol support, aligning the device to transceiver-based link aggregation and protocol translation.
• Digital signal processing — Significant embedded memory and the Stratix IV family’s DSP-oriented architecture elements support filtering, FFTs and other real-time signal processing tasks.
• Custom compute and prototyping — High logic density and a large I/O count enable complex hardware acceleration blocks, custom processors and board-level validation platforms.

Unique Advantages

• Large programmable fabric: 353,600 logic elements provide headroom for complex finite-state machines, datapaths and custom accelerators without immediate partitioning.
• Substantial on-chip RAM: Approximately 23.1 Mbits of embedded memory reduces external memory dependence for buffering and local storage.
• Extensive I/O: 564 I/Os simplify integration with multiple peripherals, memory interfaces and front-end devices.
• Stratix IV family documentation: Series-level features such as high-speed transceivers, DSP blocks and advanced clocking are documented in the Stratix IV Device Handbook to aid design and integration.
• Compact system integration: 1152-FBGA (35×35) / 1152-BBGA FCBGA surface-mount packages support dense PCB layouts while providing high pin-count connectivity.
• Regulatory and commercial readiness: RoHS compliance and a defined commercial temperature range support standard production designs and supply-chain requirements.

Why Choose EP4SGX360HF35C3G?

The EP4SGX360HF35C3G positions itself as a high-density Stratix IV FPGA option for designs that require a mix of large logic capacity, significant embedded memory and wide external connectivity. Its package options and surface-mount form factor enable compact, high-pin-count board implementations.

Designers targeting compute-intensive logic, DSP workloads or transceiver-based systems will find the documented Stratix IV family features—such as high-speed transceiver support, clock networks and DSP blocks—relevant to system-level integration and long-term design scalability.

Request a quote or submit a pricing and availability inquiry to begin evaluating the EP4SGX360HF35C3G for your next design.