EP4SGX360HF35C4G

IC FPGA 564 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 538 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360HF35C4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX360HF35C4G is an Intel Stratix IV family FPGA—a high-capacity, reprogrammable logic device designed for complex digital integration. It delivers a large logic fabric together with substantial on-chip memory, extensive I/O resources and family-level features such as high-speed transceivers and DSP-oriented architecture.

This commercial-grade device is suited for applications that require significant logic density, embedded memory and a broad set of I/O in a surface-mount 1152-FBGA (35 × 35) package. Key technical attributes include 353,600 logic elements, approximately 23 Mbits of embedded memory and 564 I/O pins.

Key Features

  • Core Logic  353,600 logic elements provide wide routing and logic resource capacity for large-scale FPGA implementations.
  • Embedded Memory  Approximately 23 Mbits of on-chip RAM for buffering, lookup tables and local data storage.
  • I/O Density  564 available I/O pins to support complex board-level interfacing and multi-channel connectivity.
  • Family-Level Transceiver and DSP Capabilities  Built on the Stratix IV device family, which includes high-speed transceiver features and DSP-oriented blocks for data-plane and signal-processing designs.
  • Power Supply Range  Specified core voltage supply range of 870 mV to 930 mV to match system power-rail requirements for this device.
  • Package & Mounting  1152-ball FCBGA (1152-FBGA, 35×35) package, designed for surface-mount assembly on multi-layer PCBs.
  • Operating Conditions  Commercial-grade operating temperature range of 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

  • High-speed communications  Implement protocol engines and data-path logic using the Stratix IV family transceiver features and abundant logic resources.
  • Signal processing and DSP  Use the device’s large logic capacity and embedded memory for FPGA-based filtering, aggregation and real-time processing functions.
  • High-bandwidth system integration  Consolidate bridging, traffic management and custom acceleration tasks in systems that require many I/Os and sizable on-chip RAM.
  • External memory interfaces  Deploy the FPGA as a controller or aggregator for external memory subsystems leveraging the available logic and I/O resources.

Unique Advantages

  • Large logic capacity: 353,600 logic elements enable complex designs and high levels of functional integration on a single device.
  • Substantial embedded memory: Approximately 23 Mbits of on-chip RAM reduce dependence on external memory for buffering and intermediate storage.
  • High I/O count: 564 I/Os simplify board-level routing for multi-channel and multi-protocol systems.
  • Stratix IV family features: Family-level capabilities such as high-speed transceivers and DSP-oriented architecture support advanced communications and signal-processing tasks.
  • Commercial-grade robustness: Specified for 0 °C to 85 °C operation with RoHS-compliant manufacturing for mainstream electronics deployments.
  • Compact package for dense designs: 1152-FBGA (35×35) package and surface-mount mounting simplify integration into high-density PCBs.

Why Choose EP4SGX360HF35C4G?

The EP4SGX360HF35C4G positions itself as a high-capacity Stratix IV FPGA targeted at designs that need extensive logic resources, significant embedded memory and high I/O density within a compact surface-mount FBGA package. Its family-level features—highlighted by high-speed transceiver and DSP capabilities—make it appropriate for demanding communications and signal-processing applications.

Choose this device for projects that require scalability of logic and memory, robust on-chip resources to minimize external components, and a commercial-grade operating window. The combination of 353,600 logic elements, approximately 23 Mbits of embedded RAM and 564 I/Os delivers a balance of performance and integration for complex system-level designs.

For pricing, availability and to request a formal quote for EP4SGX360HF35C4G, please submit a quote request or contact our sales channel to obtain current lead times and order options.

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