EP4SGX360HF35C4N

The EP4SGX360HF35C4N is a Stratix® IV GX field-programmable gate array (FPGA) from Intel, delivering a large programmable fabric and substantial on-chip memory for complex digital designs. It combines 353,600 logic elements with high I/O density and a 1152-ball FBGA package to address designs that require dense logic, significant embedded RAM, and broad board-level interfacing.

Targeted for commercial-grade applications, this device offers documented electrical, switching, PLL, DSP block and transceiver specifications in the Stratix IV device handbook, enabling detailed system-level design and integration.

Key Features

• Programmable Logic Capacity — 353,600 logic elements provide a large programmable fabric for implementing complex logic, state machines, and custom accelerators.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for buffering, lookup tables and on-chip data storage to reduce external memory needs.
• I/O Density — 564 general-purpose I/O pins support extensive peripheral, parallel and multi-channel interfacing without additional bridge devices.
• Package and Mounting — 1152-BBGA / 1152-FBGA (35 × 35 mm) surface-mount package for high pin-count board implementations and compact BOM integration.
• Supply Voltage — Core supply range specified at 870 mV to 930 mV to match low-voltage system domains.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial environments.
• Standards and Documentation — RoHS compliant; detailed device handbook entries available for DC/switching characteristics, power consumption, PLLs, DSP and other periphery specifications.

Typical Applications

• High-density digital systems — Implement complex logic and control functions using the large logic element count and flexible fabric.
• Memory-intensive processing — On-chip RAM (approximately 23.1 Mbits) supports buffering, LUT-based functions and embedded data storage to reduce external memory traffic.
• High I/O interface hubs — 564 I/Os enable aggregation of multiple parallel interfaces, bridges and peripheral connections on a single device.
• Compact board-level integration — The 1152-ball FBGA package and surface-mount mounting facilitate space-efficient, high-pin-count PCB designs.

Unique Advantages

• Large programmable fabric: 353,600 logic elements let you consolidate functionality that might otherwise require multiple devices, simplifying board design.
• Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 564 I/Os provide flexibility to connect sensors, peripherals and high-pin-count interfaces directly to the FPGA.
• Compact high-pin-count package: 1152-ball FBGA (35 × 35 mm) balances pin density and PCB area for dense system implementations.
• Low-voltage core operation: Core supply range of 870 mV–930 mV aligns with modern low-voltage power domains for efficient integration.
• Well-documented device handbook: Comprehensive datasheet and handbook sections cover DC characteristics, switching, PLLs, DSP blocks and transceiver/datapath details to support detailed system design.

Why Choose EP4SGX360HF35C4N?

The EP4SGX360HF35C4N positions itself as a high-density, commercial-grade FPGA option for designs requiring a large programmable fabric, significant embedded memory and broad I/O capability. Its 353,600 logic elements and approximately 23.1 Mbits of on-chip RAM make it suitable for consolidating complex functions and reducing system-level component counts.

Backed by detailed device documentation, RoHS compliance and Intel’s Stratix IV device handbook material, this FPGA is appropriate for engineering teams and procurement seeking a scalable, well-documented platform for demanding digital and interface-heavy applications.

Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX360HF35C4N and discuss how it fits your next design project.