EP4SGX360HF35I4

The EP4SGX360HF35I4 is a Stratix® IV GX field programmable gate array (FPGA) offered in a 1152-BBGA (35×35 FCBGA) package for surface-mount assembly. It provides a high logic-element count alongside substantial on-chip memory and a large I/O complement, designed for industrial-grade systems requiring dense programmable logic and flexible interfacing.

With approximately 23.1 Mbits of embedded memory, 564 I/Os, and a specified operating range from −40 °C to 100 °C, this device targets designs that need high integration, significant on-chip RAM capacity, and robust temperature tolerance while operating within a narrow core voltage window.

Key Features

• Logic Capacity — 353,600 logic elements to support complex, high-density logic implementations and large-scale programmable functions.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic blocks.
• I/O Density — 564 I/Os for wide interfacing options and high-pin-count connectivity in system designs.
• Package & Mounting — 1152-BBGA (FCBGA) 35×35 supplier device package delivered for surface-mount PCB assembly.
• Power Supply — Core voltage specified between 870 mV and 930 mV to match platform power budgeting and supply design.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support deployments in demanding thermal environments.
• Regulatory Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing — Implement complex, parallel algorithms and custom datapaths using the device’s large logic capacity and embedded memory.
• Memory-intensive logic — Use the approximately 23.1 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage without external memory dependency.
• High-pin-count interfacing — Leverage 564 I/Os for multi-channel I/O, broad sensor arrays, or extensive peripheral connectivity.

Unique Advantages

• High integration density: 353,600 logic elements reduce the need for multiple devices and simplify board-level integration.
• Large on-chip memory: Approximately 23.1 Mbits of RAM enable local data handling and reduce external memory traffic and system BOM.
• Extensive I/O capability: 564 I/Os support complex interconnect requirements and flexible interface mapping.
• Industrial-grade thermal tolerance: Rated from −40 °C to 100 °C to support operation in challenging environmental conditions.
• Compact BGA packaging: 1152-BBGA (35×35 FCBGA) provides a high-pin-count solution in a condensed footprint for space-constrained designs.
• RoHS compliant: Aligns with established environmental manufacturing standards.

Why Choose EP4SGX360HF35I4?

The EP4SGX360HF35I4 positions itself for designs that demand a combination of large programmable logic capacity, substantial embedded memory, and wide I/O availability within an industrial temperature envelope. Its specification of core voltage, package type, and surface-mount readiness make it suitable for systems where integration density and thermal robustness are priorities.

This device is suited to engineering teams building scalable, high-density FPGA-based solutions that require on-chip memory resources and extensive interfacing. Selecting the EP4SGX360HF35I4 provides long-term value through a high level of integration, clear power and thermal specifications, and RoHS compliance for streamlined manufacturing.

If you would like pricing, availability, or to submit a request for a quote for EP4SGX360HF35I4, please request a quote or submit an inquiry and a sales representative will follow up with details.