EP4SGX360HF35I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 932 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360HF35I3G – * Field Programmable Gate Array (FPGA) IC
The EP4SGX360HF35I3G is an Intel Stratix IV–series field programmable gate array (FPGA) supplied in a 1152-ball FCBGA package. It combines a large logic fabric with substantial on-chip memory and a wide complement of I/O to address high-performance, industrial-grade digital designs.
Typical use cases include high-throughput signal processing, protocol bridging and interface consolidation, and other applications that require large programmable logic capacity, extensive I/O, and operation across an extended temperature range.
Key Features
- Core Logic 353,600 logic elements for implementing large-scale programmable logic, control and datapath functions.
- Embedded Memory Approximately 23 Mbits of embedded memory (23,105,536 total RAM bits) to support on-chip buffering, FIFOs and data storage.
- I/O Capacity 564 device I/O pins, enabling broad external interfacing and multiple parallel or high-pin-count bus connections.
- Package and Mounting 1152-ball FCBGA package (35 × 35 mm) supplied in a surface-mount form factor for compact board integration.
- Power Specified core voltage supply range from 870 mV to 930 mV, enabling controlled power design and supply planning.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
- Compliance RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.
- Stratix IV Family Architecture Device belongs to the Stratix IV family (series handbook references), which documents features such as high-speed transceivers, DSP blocks, flexible clocking and external memory interfaces at the series level.
Typical Applications
- High-Speed Communications Use the device where large logic capacity and series-level high-speed transceiver support are needed for protocol bridging, switching or aggregation.
- Signal and Image Processing Deploy the FPGA for compute-intensive DSP pipelines, leveraging the large logic array and abundant on-chip memory for buffering and intermediate storage.
- Industrial Control and Automation Take advantage of the industrial temperature rating and extensive I/O for complex control systems, machine vision preprocessing, and sensor aggregation.
- System Integration Integrate multiple subsystems (memory interfaces, DSP, custom logic) into a single programmable device to reduce board-level complexity.
Unique Advantages
- Large Logic Density: 353,600 logic elements provide the headroom for complex algorithms, multi-channel processing and control logic in a single device.
- Substantial On-Chip Memory: Approximately 23 Mbits of embedded RAM minimizes external memory dependence for many buffering and state-storage requirements.
- High I/O Count: 564 I/O pins enable flexible connectivity for parallel buses, wide data paths or mixed-signal front-end interfacing.
- Industrial Temperature Range: Operation from −40 °C to 100 °C supports deployment in demanding environments without derating logic capacity claims.
- Compact FCBGA Package: 1152-ball, 35 × 35 mm FCBGA keeps system BOM compact while providing the necessary pin count for complex designs.
- Regulatory Compliance: RoHS compliance supports lead-free manufacturing flows and environmental requirements.
Why Choose EP4SGX360HF35I3G?
The EP4SGX360HF35I3G positions itself as a high-capacity, industrial-grade FPGA option within the Stratix IV family, combining hundreds of thousands of logic elements with sizable embedded memory and broad I/O in a single FCBGA package. Its electrical and thermal specifications allow integration into designs that require sustained operation across an extended temperature range and precise power budgeting.
This part is suited to engineering teams building large-scale programmable systems—such as high-throughput signal processing, industrial automation, and communications equipment—where consolidation of functions into a single programmable device reduces board complexity and accelerates system-level development.
If you would like pricing, availability or to request a formal quote for EP4SGX360HF35I3G, please submit a quote request or inquiry through your preferred procurement channel.

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