EP4SGX360HF35I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 615 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360HF35I4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX360HF35I4G is an Intel Stratix IV family FPGA device optimized for high-bandwidth, programmable system designs. It combines a large logic capacity, substantial on-chip memory, and plentiful I/O in a high-density FCBGA package suited to industrial temperature environments.
This device targets designs that require extensive programmable logic, embedded memory and flexible I/O—including communications, signal processing, and high-throughput interface applications—delivering integration and scalability for complex FPGA-based systems.
Key Features
- Logic Capacity Approximately 353,600 logic elements to implement large, complex logic functions and custom accelerators.
- Embedded Memory Approximately 23.1 Mbits of embedded memory to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
- I/O Density 564 I/O nodes to interface with multiple high-speed peripherals, memory buses, and external devices from a single device.
- High-Speed Fabric Features Device family documentation lists high-speed transceiver and differential I/O capabilities, enabling wide protocol support and high aggregate data bandwidth for communications and external memory interfaces.
- Clocking and DSP Support Stratix IV family references include advanced clock networks, PLLs, and DSP-oriented architecture features suitable for signal processing tasks.
- Power Rail Core voltage supply range of 870 mV to 930 mV for the device core power domain.
- Package and Mounting 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package for compact, high-density board designs.
- Industrial Temperature Grade Operating temperature range from −40 °C to 100 °C to meet industrial-environment requirements.
- Environmental Compliance RoHS-compliant manufacturing status.
Typical Applications
- High-Speed Networking & Telecom Use the device's high-speed transceiver capabilities and large logic/memory resources to implement protocol processing, packet inspection, and line cards requiring substantial bandwidth.
- Signal Processing & DSP Leverage the on-chip memory and Stratix IV family DSP-oriented features for filtering, FFTs, and real-time data processing pipelines.
- Memory Interface Controllers Implement external memory interfaces and buffering logic using the device's I/O density and embedded RAM to support high-throughput memory subsystems.
- Custom Accelerators Deploy large custom logic and data-path accelerators that benefit from abundant logic elements and dedicated clocking/PLL resources.
Unique Advantages
- Large Programmable Resource Pool: Approximately 353,600 logic elements and ~23.1 Mbits of embedded memory enable complex, integrated designs without immediate external ASICs.
- High I/O Count: 564 I/O points simplify board-level integration with multiple peripherals and parallel interfaces, reducing external multiplexing complexity.
- Designed for High Bandwidth: Family-level high-speed transceiver and differential I/O features support wide protocol compatibility and high aggregate throughput requirements.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial applications.
- Compact, High-Density Packaging: 1152-ball FCBGA (35×35) enables dense board layouts while maintaining signal integrity for complex multi-channel designs.
- Standards-Conscious Manufacturing: RoHS-compliant status supports regulatory and environmental objectives.
Why Choose EP4SGX360HF35I4G?
The EP4SGX360HF35I4G delivers a balanced combination of large logic capacity, substantial embedded memory, and high I/O density in an industrial-grade Stratix IV device package. It is well suited for engineers building high-throughput communications, signal processing, and custom acceleration platforms that require on-chip scalability and robust thermal performance.
With family-level features such as advanced clock networks, PLLs, high-speed differential I/O and transceiver support, this device provides a platform for scalable designs where integration, predictable supply voltage domains, and industrial temperature operation are key considerations.
Request a quote or submit an inquiry to check pricing and availability for EP4SGX360HF35I4G and to discuss how this Stratix IV FPGA can fit your next project.

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