EP4SGX360HF35I4G

IC FPGA 564 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 615 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360HF35I4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX360HF35I4G is an Intel Stratix IV family FPGA device optimized for high-bandwidth, programmable system designs. It combines a large logic capacity, substantial on-chip memory, and plentiful I/O in a high-density FCBGA package suited to industrial temperature environments.

This device targets designs that require extensive programmable logic, embedded memory and flexible I/O—including communications, signal processing, and high-throughput interface applications—delivering integration and scalability for complex FPGA-based systems.

Key Features

  • Logic Capacity  Approximately 353,600 logic elements to implement large, complex logic functions and custom accelerators.
  • Embedded Memory  Approximately 23.1 Mbits of embedded memory to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
  • I/O Density  564 I/O nodes to interface with multiple high-speed peripherals, memory buses, and external devices from a single device.
  • High-Speed Fabric Features  Device family documentation lists high-speed transceiver and differential I/O capabilities, enabling wide protocol support and high aggregate data bandwidth for communications and external memory interfaces.
  • Clocking and DSP Support  Stratix IV family references include advanced clock networks, PLLs, and DSP-oriented architecture features suitable for signal processing tasks.
  • Power Rail  Core voltage supply range of 870 mV to 930 mV for the device core power domain.
  • Package and Mounting  1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package for compact, high-density board designs.
  • Industrial Temperature Grade  Operating temperature range from −40 °C to 100 °C to meet industrial-environment requirements.
  • Environmental Compliance  RoHS-compliant manufacturing status.

Typical Applications

  • High-Speed Networking & Telecom  Use the device's high-speed transceiver capabilities and large logic/memory resources to implement protocol processing, packet inspection, and line cards requiring substantial bandwidth.
  • Signal Processing & DSP  Leverage the on-chip memory and Stratix IV family DSP-oriented features for filtering, FFTs, and real-time data processing pipelines.
  • Memory Interface Controllers  Implement external memory interfaces and buffering logic using the device's I/O density and embedded RAM to support high-throughput memory subsystems.
  • Custom Accelerators  Deploy large custom logic and data-path accelerators that benefit from abundant logic elements and dedicated clocking/PLL resources.

Unique Advantages

  • Large Programmable Resource Pool: Approximately 353,600 logic elements and ~23.1 Mbits of embedded memory enable complex, integrated designs without immediate external ASICs.
  • High I/O Count: 564 I/O points simplify board-level integration with multiple peripherals and parallel interfaces, reducing external multiplexing complexity.
  • Designed for High Bandwidth: Family-level high-speed transceiver and differential I/O features support wide protocol compatibility and high aggregate throughput requirements.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial applications.
  • Compact, High-Density Packaging: 1152-ball FCBGA (35×35) enables dense board layouts while maintaining signal integrity for complex multi-channel designs.
  • Standards-Conscious Manufacturing: RoHS-compliant status supports regulatory and environmental objectives.

Why Choose EP4SGX360HF35I4G?

The EP4SGX360HF35I4G delivers a balanced combination of large logic capacity, substantial embedded memory, and high I/O density in an industrial-grade Stratix IV device package. It is well suited for engineers building high-throughput communications, signal processing, and custom acceleration platforms that require on-chip scalability and robust thermal performance.

With family-level features such as advanced clock networks, PLLs, high-speed differential I/O and transceiver support, this device provides a platform for scalable designs where integration, predictable supply voltage domains, and industrial temperature operation are key considerations.

Request a quote or submit an inquiry to check pricing and availability for EP4SGX360HF35I4G and to discuss how this Stratix IV FPGA can fit your next project.

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