EP4SGX360KF40C3
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA |
|---|---|
| Quantity | 735 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360KF40C3 – Stratix® IV GX Field Programmable Gate Array (FPGA) IC
The EP4SGX360KF40C3 is a Stratix IV GX field programmable gate array in a 1517-FBGA (40×40) package optimized for high-density, high-I/O programmable logic designs. This commercial-grade FPGA combines a large logic fabric with substantial on-chip memory and an extensive I/O count to support complex, configurable systems.
Designed for applications that require significant logic capacity, large embedded memory resources, and broad interface connectivity, the device delivers a balance of integration and flexibility while operating within a commercial temperature range and a defined core voltage window.
Key Features
- Logic Capacity — 353,600 logic elements to implement large-scale digital designs and custom logic functions.
- Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive algorithms.
- I/O Density — 744 general-purpose I/O pins to support high-channel-count systems and multiple parallel interfaces.
- Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40); surface-mount mounting for compact board integration.
- Power and Core Voltage — Supported core supply range of 870 mV to 930 mV to align with specified device operating conditions.
- Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
- Device Handbook Coverage — Comprehensive device documentation includes DC and switching characteristics, power consumption, transceiver performance, PLL and clock-tree specifications, DSP block and TriMatrix memory block specifications, and configuration/JTAG details.
- Regulatory — RoHS compliant.
Typical Applications
- High-density programmable logic — Implement large, custom digital systems that require hundreds of thousands of logic elements.
- Memory-intensive designs — Use the device’s ~23.1 Mbits of embedded memory for buffering, packet handling, and data path storage.
- High I/O-count systems — Support multi-channel front-ends, wide parallel interfaces, or complex board-level interconnects with 744 I/Os.
- Signal processing and DSP — Leverage the device handbook’s DSP block specifications and memory resources for algorithm acceleration and real-time processing.
Unique Advantages
- High logic integration: 353,600 logic elements reduce the need for multiple devices when implementing dense logic and control functions.
- Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM supports large buffers and local data storage, simplifying system memory architecture.
- Extensive connectivity: 744 I/Os enable broad peripheral interfacing and high-channel-count designs without external multiplexing.
- Documented performance characteristics: Detailed device handbook coverage of DC/switching characteristics, transceiver performance, PLLs, and DSP blocks aids predictable system integration.
- Commercial temperature rating: Specified 0 °C to 85 °C operating range for standard commercial applications and environments.
- RoHS compliant: Aligns with environmental compliance requirements for lead-free manufacturing processes.
Why Choose EP4SGX360KF40C3?
The EP4SGX360KF40C3 positions itself as a high-capacity Stratix IV GX FPGA option for designs that demand many logic elements, sizable embedded memory, and a large count of I/Os. With its documented electrical, timing, transceiver, and DSP-related specifications in the device handbook, the part supports engineering teams that require detailed technical data for system design and validation.
This device is well suited to customers building complex, scalable programmable solutions where integration density, on-chip memory, and broad connectivity are primary considerations. The combination of package options, commercial-grade temperature rating, and RoHS compliance contributes to a robust choice for production deployments within its specified operating conditions.
Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX360KF40C3 and to discuss how it can fit into your next high-density FPGA design.

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