EP4SGX360KF40C2N

The EP4SGX360KF40C2N is a Stratix® IV GX field programmable gate array (FPGA) optimized for high-density logic integration and large I/O requirements. It combines 353,600 logic elements with approximately 23.1 Mbits of on-chip RAM and a 744-pin I/O count in a 1517-BBGA (FCBGA) surface-mount package.

This commercial-grade FPGA is suited to system designs that demand substantial programmable logic, embedded memory, and broad interfacing capability while operating within a 0 °C to 85 °C temperature range and a core supply window of 870 mV to 930 mV.

Key Features

• Core Logic 353,600 logic elements provide high-density programmable logic resources for complex digital designs.
• Embedded Memory Approximately 23.1 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions without external RAM.
• I/O Capacity 744 I/O pins enable extensive external device interfacing and multi-channel connectivity in a single device.
• Package and Mounting Provided in a 1517-BBGA (1517-FBGA, 40×40) FCBGA surface-mount package for compact board-level integration.
• Power Core supply voltage range of 870 mV to 930 mV allows precise power budgeting for the programmable fabric.
• Operating Range Commercial-grade operating temperature from 0 °C to 85 °C suitable for typical commercial and enterprise applications.
• Compliance RoHS compliant to meet standard environmental requirements for lead-free assembly.

Typical Applications

• High-density custom logic — Implements large, complex state machines and datapaths where high logic element counts are required.
• Memory-intensive designs — Uses on-chip RAM for buffering, look-up tables, and storage to reduce reliance on external memory.
• Multi-channel I/O systems — Supports designs that require many parallel interfaces, sensors, or communication lanes.
• FPGA-based prototyping and development — Provides a dense platform for proof-of-concept and pre-production validation of complex digital designs.

Unique Advantages

• High logic density: 353,600 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 23.1 Mbits of on-chip RAM lowers external memory needs and improves data throughput for on-chip processing.
• Extensive I/O count: 744 I/Os allow flexible interfacing to peripherals, ADCs/DACs, transceivers, and multi-channel sensors.
• Compact package integration: 1517-BBGA (40×40 FCBGA) surface-mount package supports high-density PCB layouts and streamlined assembly.
• Predictable power envelope: Defined core supply range of 870 mV–930 mV aids in accurate power budgeting for system design.
• RoHS compliant: Facilitates compliance with lead-free manufacturing and environmental regulations.

Why Choose EP4SGX360KF40C2N?

The EP4SGX360KF40C2N positions itself as a high-capacity, commercial-grade FPGA for designs that require a combination of dense programmable logic, significant embedded memory, and large I/O capability in a single package. Its specifications support consolidation of complex digital functions while enabling compact board implementations.

This device is appropriate for engineering teams building memory-rich, I/O-intensive systems that need predictable power characteristics and standard commercial temperature operation. The combination of logic capacity, on-chip RAM, and I/O density delivers long-term design flexibility and scalability within the Stratix® IV GX family.

Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX360KF40C2N and to discuss how this FPGA can fit your project requirements.