EP4SGX360HF35I4N

The EP4SGX360HF35I4N is a Stratix IV GX field programmable gate array manufactured by Intel. This device integrates a high density of logic resources, abundant embedded memory, and a large I/O count in a 1152-ball BGA package targeted for industrial applications.

With approximately 353,600 logic elements, roughly 23.1 Mbits of embedded memory and 564 I/Os, the device is suited for complex digital processing, high‑density I/O aggregation and series-level functions documented in the Stratix IV device handbook such as transceiver, DSP block and PLL capabilities.

Key Features

• Core Logic  Approximately 353,600 logic elements provide the fabric for large-scale custom logic, control and datapath implementations.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables and memory‑intensive algorithms.
• I/O Capacity  564 general-purpose I/Os enable high-density board-level interfacing for sensors, peripherals and parallel interfaces.
• Power Domain  Specified core supply range of 0.87–0.93 V for the device core, supporting predictable power planning on system designs.
• Package & Mounting  1152-ball BGA (FCBGA / supplier package 1152-FBGA, 35×35) in a surface‑mount form factor for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements common in industrial applications.
• Standards & Compliance  RoHS compliant, aligning with common environmental and end‑market requirements.
• Series-Level Technical Capabilities  The Stratix IV device handbook documents series features such as transceiver performance specifications, DSP block and PLL specifications that support high‑speed serial links and signal processing use cases.

Typical Applications

• High‑speed communications  Use the device where large I/O counts and the Stratix IV series transceiver and datapath capabilities are required for protocol processing and data aggregation.
• Signal processing and DSP  Leverage the device’s large logic capacity and embedded memory for FPGA‑based DSP pipelines and real‑time processing tasks.
• Industrial control and instrumentation  Industrial temperature rating and extensive I/O make the device suitable for complex control systems, sensor aggregation and deterministic logic control.
• High‑density system integration  Compact 1152‑ball BGA package and surface‑mount mounting support space‑constrained, board‑level implementations requiring significant programmable logic.

Unique Advantages

• Significant logic capacity: Approximately 353,600 logic elements enable implementation of large custom datapaths and control logic without external ASICs.
• Substantial on‑chip memory: Approximately 23.1 Mbits of embedded RAM reduces external memory dependencies for buffering and lookup tables.
• High I/O density: 564 I/Os simplify board design by supporting multiple interfaces and parallel connections directly to the FPGA fabric.
• Industrial robustness: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with environmental constraints.
• Compact integration: 1152‑ball BGA (35×35) package provides high resource density in a surface‑mount package suitable for modern PCB assemblies.
• Series‑documented features: Stratix IV device handbook coverage of transceivers, DSP blocks and PLLs gives designers referenceable series‑level technical specifications to plan system architectures.

Why Choose EP4SGX360HF35I4N?

The EP4SGX360HF35I4N combines a high logic element count, substantial embedded memory and a large number of I/Os in a compact BGA package, making it a strong choice for industrial designs that require dense programmable logic and flexible I/O. Its documented series capabilities for transceivers, DSP and clocking give engineering teams referenceable technical material for system planning.

This device is well suited to customers building complex communications, signal processing or control systems that demand industrial temperature operation, predictable core voltage planning and high integration density to reduce board‑level complexity and BOM count.

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