EP4SGX360KF40C3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA |
|---|---|
| Quantity | 430 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360KF40C3N – Stratix® IV GX Field Programmable Gate Array (FPGA)
The EP4SGX360KF40C3N is an Intel Stratix IV GX family FPGA in a 1517-BBGA (FCBGA) package. It integrates a high-density FPGA fabric and system-level features described for the Stratix IV device family, including high-speed transceiver capabilities and enhanced I/O and clocking resources.
This device targets designs that require large logic capacity, significant embedded memory, and extensive I/O connectivity. It is provided as a commercial-grade, surface-mount FPGA with RoHS compliance and a specified operating range of 0 °C to 85 °C.
Key Features
- Core Density Provides 353,600 logic elements, enabling implementation of large, complex digital designs.
- Embedded Memory Approximately 23.1 Mbits of embedded memory (23,105,536 total RAM bits) for on-chip buffering and storage.
- I/O Capacity 744 user I/Os to support wide external connectivity and dense board-level interfaces.
- Stratix IV GX Family Features Includes family-level capabilities such as high-speed transceiver features, DSP blocks, PLLs and clock networks, and system integration facilities as documented for Stratix IV devices.
- High-Speed I/O Enhancements Family documentation references high-speed differential I/O with DPA and Soft-CDR and external memory interface support suitable for high aggregate data bandwidth.
- Power and Supply Specified supply voltage range of 870 mV to 930 mV for the device core.
- Package & Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type.
- Commercial Grade & Environmental Commercial device grade with a specified operating temperature of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High-Speed Communications Implement protocol engines and data-paths that leverage the Stratix IV GX family’s high-speed transceiver features and I/O density.
- Signal Processing and DSP On-chip DSP block resources and large logic capacity support compute-intensive signal processing tasks.
- External Memory Interfaces Deploy controllers and interfaces for external memory using the family’s documented external memory interface capabilities and abundant I/Os.
- System Integration and Prototyping High logic density and ample embedded RAM enable hardware integration and system-level prototyping for complex FPGA-based designs.
Unique Advantages
- High Logic Capacity: 353,600 logic elements provide the headroom to implement complex, multi-function designs without immediate migration.
- Significant On-Chip Memory: Approximately 23.1 Mbits of embedded memory reduces reliance on external RAM for buffering and local data storage.
- Extensive I/O Count: 744 I/Os simplify board-level interfacing and support multiple parallel buses or high-pin-count peripherals.
- Family-Level High-Speed Features: Stratix IV GX documentation highlights high-speed transceivers, differential I/O enhancements, and protocol flexibility for data-intensive applications.
- Commercial Grade and Compliance: Specified commercial operating range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
- Compact Surface-Mount Packaging: 1517-BBGA FCBGA package supports high-density board layouts while providing the necessary signal density.
Why Choose EP4SGX360KF40C3N?
The EP4SGX360KF40C3N combines the Stratix IV GX family’s documented system-level capabilities with high logic density, substantial embedded memory, and a large I/O complement—making it suitable for designers building complex, data-rich FPGA systems. Its commercial-grade specification and RoHS compliance make it appropriate for mainstream embedded and communications products within the stated temperature and supply ranges.
This device is a fit for engineering teams that need scalable FPGA resources, extensive I/O, and the family-level high-speed transceiver and memory interface features documented for the Stratix IV GX devices.
Request a quote or submit a pricing inquiry to confirm availability and lead time for EP4SGX360KF40C3N and to discuss volume options or technical questions.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018