EP4SGX360KF40C3N

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA

Quantity 430 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360KF40C3N – Stratix® IV GX Field Programmable Gate Array (FPGA)

The EP4SGX360KF40C3N is an Intel Stratix IV GX family FPGA in a 1517-BBGA (FCBGA) package. It integrates a high-density FPGA fabric and system-level features described for the Stratix IV device family, including high-speed transceiver capabilities and enhanced I/O and clocking resources.

This device targets designs that require large logic capacity, significant embedded memory, and extensive I/O connectivity. It is provided as a commercial-grade, surface-mount FPGA with RoHS compliance and a specified operating range of 0 °C to 85 °C.

Key Features

  • Core Density  Provides 353,600 logic elements, enabling implementation of large, complex digital designs.
  • Embedded Memory  Approximately 23.1 Mbits of embedded memory (23,105,536 total RAM bits) for on-chip buffering and storage.
  • I/O Capacity  744 user I/Os to support wide external connectivity and dense board-level interfaces.
  • Stratix IV GX Family Features  Includes family-level capabilities such as high-speed transceiver features, DSP blocks, PLLs and clock networks, and system integration facilities as documented for Stratix IV devices.
  • High-Speed I/O Enhancements  Family documentation references high-speed differential I/O with DPA and Soft-CDR and external memory interface support suitable for high aggregate data bandwidth.
  • Power and Supply  Specified supply voltage range of 870 mV to 930 mV for the device core.
  • Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type.
  • Commercial Grade & Environmental  Commercial device grade with a specified operating temperature of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High-Speed Communications  Implement protocol engines and data-paths that leverage the Stratix IV GX family’s high-speed transceiver features and I/O density.
  • Signal Processing and DSP  On-chip DSP block resources and large logic capacity support compute-intensive signal processing tasks.
  • External Memory Interfaces  Deploy controllers and interfaces for external memory using the family’s documented external memory interface capabilities and abundant I/Os.
  • System Integration and Prototyping  High logic density and ample embedded RAM enable hardware integration and system-level prototyping for complex FPGA-based designs.

Unique Advantages

  • High Logic Capacity:  353,600 logic elements provide the headroom to implement complex, multi-function designs without immediate migration.
  • Significant On-Chip Memory:  Approximately 23.1 Mbits of embedded memory reduces reliance on external RAM for buffering and local data storage.
  • Extensive I/O Count:  744 I/Os simplify board-level interfacing and support multiple parallel buses or high-pin-count peripherals.
  • Family-Level High-Speed Features:  Stratix IV GX documentation highlights high-speed transceivers, differential I/O enhancements, and protocol flexibility for data-intensive applications.
  • Commercial Grade and Compliance:  Specified commercial operating range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
  • Compact Surface-Mount Packaging:  1517-BBGA FCBGA package supports high-density board layouts while providing the necessary signal density.

Why Choose EP4SGX360KF40C3N?

The EP4SGX360KF40C3N combines the Stratix IV GX family’s documented system-level capabilities with high logic density, substantial embedded memory, and a large I/O complement—making it suitable for designers building complex, data-rich FPGA systems. Its commercial-grade specification and RoHS compliance make it appropriate for mainstream embedded and communications products within the stated temperature and supply ranges.

This device is a fit for engineering teams that need scalable FPGA resources, extensive I/O, and the family-level high-speed transceiver and memory interface features documented for the Stratix IV GX devices.

Request a quote or submit a pricing inquiry to confirm availability and lead time for EP4SGX360KF40C3N and to discuss volume options or technical questions.

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