EP4SGX360KF40I3

The EP4SGX360KF40I3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for industrial-grade applications. It provides a high-density programmable fabric with 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 744 user I/O pins in a 1517-FBGA package.

With a supply voltage range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, this surface-mount FPGA delivers a combination of integration, I/O capacity, and thermal range suitable for demanding system designs while remaining RoHS compliant.

Key Features

• Core and Logic 353,600 logic elements provide a large programmable fabric for complex digital designs and high logic density implementations.
• Embedded Memory Approximately 23.1 Mbits of on-chip RAM support data buffering, state storage, and embedded algorithm implementation without external memory.
• I/O Capacity 744 user I/O pins accommodate wide parallel interfaces, large connector counts, and extensive peripheral integration.
• Package and Mounting Supplied in a 1517-BBGA / 1517-FBGA (40×40) FCBGA surface-mount package to support compact board layouts and high pin density.
• Power Nominal supply range of 870 mV to 930 mV enables design around a defined core voltage window for power planning.
• Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C, suitable for extended temperature environments.
• Compliance RoHS compliant, supporting regulatory and environmental requirements for lead-free manufacturing.

Typical Applications

• High-density digital processing — Implement large-scale logic functions and parallel processing pipelines using the device's 353,600 logic elements and substantial embedded RAM.
• Complex I/O aggregation — Support systems that require many external interfaces or wide parallel buses with 744 available I/O pins.
• Industrial control and automation — Deploy in industrial environments leveraging the industrial-grade temperature range (−40 °C to 100 °C) and surface-mount packaging.

Unique Advantages

• Large programmable capacity: 353,600 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM reduce dependence on external memory for buffering and state storage.
• Extensive I/O resource: 744 I/O pins provide flexibility for high-pin-count interfaces and complex connectivity requirements.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact, high-density package: 1517-FBGA (40×40) package delivers high pin density in a surface-mount form factor suitable for space-constrained boards.
• RoHS compliance: Meets lead-free manufacturing requirements for environmentally constrained programs.

Why Choose EP4SGX360KF40I3?

The EP4SGX360KF40I3 positions itself as a high-density Stratix® IV GX FPGA option for designs that require extensive logic resources, large embedded memory, and a high I/O count within an industrial temperature envelope. Its combination of capacity, packaging, and RoHS compliance makes it suitable for engineers consolidating multiple functions into a single programmable device.

This device is well suited for teams and projects that need scalable, reliable programmable logic with significant on-chip resources and a clearly defined supply and thermal profile, enabling predictable integration into complex systems.

Request a quote or submit an inquiry for pricing and availability of the EP4SGX360KF40I3 to begin evaluating this FPGA in your design.