EP4SGX360KF40I3NAC

The EP4SGX360KF40I3NAC is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density programmable logic applications. It integrates 353,600 logic elements, approximately 23 Mbits of embedded memory, and up to 744 I/O pins in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package.

As a member of the Stratix IV GX device family (as documented in the device handbook), the device targets applications that require large on-chip memory, extensive I/O resources, and advanced fabric capabilities. The device is specified for industrial operation with a core voltage range of 870 mV to 930 mV and an operating temperature range of −40°C to 100°C.

Key Features

• Core Logic — 353,600 logic elements (cells) to implement complex programmable logic and custom compute functions.
• Embedded Memory — Approximately 23 Mbits of on-chip RAM to support large buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Resources — Up to 744 general-purpose I/O pins for dense peripheral and system interfacing.
• Package & Mounting — 1517-BBGA (supplier device package: 1517-FBGA, 40×40) in a surface-mount ball-grid array to minimize PCB footprint while enabling high I/O density.
• Power — Core voltage supply specified from 870 mV to 930 mV to match system-level power distribution requirements.
• Temperature & Grade — Industrial grade qualification with an operating temperature range of −40°C to 100°C for deployment in temperature-challenging environments.
• Stratix IV GX Family Capabilities — Part of the Stratix IV GX series described in the device handbook, which documents architecture features including FPGA fabric, I/O features, and high-speed transceiver capabilities.

Typical Applications

• High-bandwidth communications and networking — Leverage large logic capacity and on-chip memory to implement packet processing, protocol handling, and interface bridging.
• Signal processing and DSP — Use dense logic and embedded RAM for real-time signal filtering, buffering, and algorithm acceleration.
• Instrumentation and test equipment — Support I/O-intensive measurement systems and custom data acquisition with abundant I/O and memory resources.
• Custom compute and prototyping — Implement large custom accelerators and prototypes requiring substantial logic elements and integrated memory.

Unique Advantages

• High logic capacity: 353,600 logic elements enable implementation of large, complex designs without external logic expansion.
• Significant on-chip memory: Approximately 23 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
• Extensive I/O: 744 I/O pins provide flexibility for dense peripheral connectivity and multi-channel interfaces.
• Industrial temperature range: Rated for −40°C to 100°C operation to support deployments in challenging thermal environments.
• Compact high-density package: 1517-BBGA (40×40 FBGA) surface-mount packaging delivers a high I/O-to-footprint ratio for space-constrained designs.
• Family-level documentation: Stratix IV GX device handbook provides architecture and transceiver feature information useful for system integration and verification.

Why Choose EP4SGX360KF40I3NAC?

The EP4SGX360KF40I3NAC positions itself as a high-density, industrial-grade FPGA solution that combines a large fabric of 353,600 logic elements with substantial embedded memory and a high I/O count. Its specification for a low-voltage core supply and wide operating temperature range make it suitable for systems that demand both performance and environmental robustness.

This device is well suited for engineering teams designing complex data-paths, high-bandwidth communications modules, or I/O-rich instrumentation where on-chip memory and logic density reduce bill-of-materials and simplify board-level architecture. Documentation for the Stratix IV GX family supports integration into designs that rely on advanced fabric and transceiver capabilities.

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