EP4SGX360KF40I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,384 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360KF40I4N – Stratix® IV GX FPGA, 353,600 logic elements
The EP4SGX360KF40I4N is a Stratix® IV GX field programmable gate array delivered in a 1517-ball FCBGA package for surface-mount applications. As part of the Stratix IV GX device family, it targets high-density, high-bandwidth FPGA implementations where large logic capacity, abundant I/O, and substantial on-chip memory are required.
With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 744 I/O pins, this industrial-grade device is built for demanding embedded and communications-oriented designs that require integration of large logic designs, external memory interfaces and series-level features such as high-speed transceivers, DSP resources and robust clocking networks.
Key Features
- High logic capacity — 353,600 logic elements to accommodate complex digital designs and wide parallel processing architectures.
- Embedded memory — Approximately 23.1 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
- Extensive I/O — 744 device I/O pins to support large external bus interfaces and multiple high-speed links.
- Stratix IV GX family capabilities — Series-level features include high-speed transceiver support, digital signal processing (DSP) blocks, PLLs and comprehensive clock networks for high-bandwidth system designs.
- Power and core voltage — Specified core supply range from 870 mV to 930 mV for precise core power management.
- Package and mounting — 1517-ball FCBGA (1517-FBGA, 40×40) surface-mount package for compact, high-density board integration.
- Industrial temperature rating — Engineered for operation from −40 °C to 100 °C to meet industrial-environment deployment requirements.
- RoHS compliant — Conforms to RoHS requirements for lead-free assembly.
Typical Applications
- High-speed networking and communications — Use the device’s high logic density, large embedded memory and series transceiver features to implement protocol processing, packet buffering and line-rate data paths.
- Signal processing and DSP acceleration — Leverage on-chip memory and Stratix IV family DSP resources for filtering, encoding/decoding and other real-time signal tasks.
- External memory interface controllers — Combine the device’s abundant I/O and embedded RAM to implement memory controllers, PHY interfaces and memory bridge logic.
- Advanced embedded computing — Deploy the FPGA as a central programmable fabric for custom compute engines, protocol fusion and system integration in industrial systems.
Unique Advantages
- High integration density: 353,600 logic elements reduce external logic and simplify system partitioning for large designs.
- Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM enables deep buffering and local data storage without immediate reliance on external memory.
- Broad external connectivity: 744 I/Os support complex multi-channel interfaces and large external bus topologies.
- Industrial-ready thermal range: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
- Compact surface-mount packaging: 1517-ball FCBGA (40×40) package balances I/O count and board-area efficiency for high-density PCB designs.
- Precise core-power window: Core supply range of 870–930 mV supports controlled power architecture and supply sequencing.
Why Choose EP4SGX360KF40I4N?
The EP4SGX360KF40I4N positions itself as a high-density, industrial-grade Stratix IV GX FPGA designed for applications that demand heavy logic integration, large on-chip memory and extensive I/O. Its family-level capabilities—such as high-speed transceivers, DSP resources and flexible clocking—support designs that require high aggregate bandwidth and protocol flexibility.
This device is well suited to engineering teams building complex communication systems, DSP-accelerated platforms and embedded computing solutions that value scalability, robust thermal range and a compact FCBGA package for production deployment.
Request a quote or submit an inquiry to obtain current pricing, lead time and availability for EP4SGX360KF40I4N.

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