EP4SGX360KF40I4N

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA

Quantity 1,384 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360KF40I4N – Stratix® IV GX FPGA, 353,600 logic elements

The EP4SGX360KF40I4N is a Stratix® IV GX field programmable gate array delivered in a 1517-ball FCBGA package for surface-mount applications. As part of the Stratix IV GX device family, it targets high-density, high-bandwidth FPGA implementations where large logic capacity, abundant I/O, and substantial on-chip memory are required.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 744 I/O pins, this industrial-grade device is built for demanding embedded and communications-oriented designs that require integration of large logic designs, external memory interfaces and series-level features such as high-speed transceivers, DSP resources and robust clocking networks.

Key Features

  • High logic capacity — 353,600 logic elements to accommodate complex digital designs and wide parallel processing architectures.
  • Embedded memory — Approximately 23.1 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
  • Extensive I/O — 744 device I/O pins to support large external bus interfaces and multiple high-speed links.
  • Stratix IV GX family capabilities — Series-level features include high-speed transceiver support, digital signal processing (DSP) blocks, PLLs and comprehensive clock networks for high-bandwidth system designs.
  • Power and core voltage — Specified core supply range from 870 mV to 930 mV for precise core power management.
  • Package and mounting — 1517-ball FCBGA (1517-FBGA, 40×40) surface-mount package for compact, high-density board integration.
  • Industrial temperature rating — Engineered for operation from −40 °C to 100 °C to meet industrial-environment deployment requirements.
  • RoHS compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

  • High-speed networking and communications — Use the device’s high logic density, large embedded memory and series transceiver features to implement protocol processing, packet buffering and line-rate data paths.
  • Signal processing and DSP acceleration — Leverage on-chip memory and Stratix IV family DSP resources for filtering, encoding/decoding and other real-time signal tasks.
  • External memory interface controllers — Combine the device’s abundant I/O and embedded RAM to implement memory controllers, PHY interfaces and memory bridge logic.
  • Advanced embedded computing — Deploy the FPGA as a central programmable fabric for custom compute engines, protocol fusion and system integration in industrial systems.

Unique Advantages

  • High integration density: 353,600 logic elements reduce external logic and simplify system partitioning for large designs.
  • Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM enables deep buffering and local data storage without immediate reliance on external memory.
  • Broad external connectivity: 744 I/Os support complex multi-channel interfaces and large external bus topologies.
  • Industrial-ready thermal range: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
  • Compact surface-mount packaging: 1517-ball FCBGA (40×40) package balances I/O count and board-area efficiency for high-density PCB designs.
  • Precise core-power window: Core supply range of 870–930 mV supports controlled power architecture and supply sequencing.

Why Choose EP4SGX360KF40I4N?

The EP4SGX360KF40I4N positions itself as a high-density, industrial-grade Stratix IV GX FPGA designed for applications that demand heavy logic integration, large on-chip memory and extensive I/O. Its family-level capabilities—such as high-speed transceivers, DSP resources and flexible clocking—support designs that require high aggregate bandwidth and protocol flexibility.

This device is well suited to engineering teams building complex communication systems, DSP-accelerated platforms and embedded computing solutions that value scalability, robust thermal range and a compact FCBGA package for production deployment.

Request a quote or submit an inquiry to obtain current pricing, lead time and availability for EP4SGX360KF40I4N.

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