EP4SGX360KF43C2G

The EP4SGX360KF43C2G is a high-capacity FPGA device built on the Stratix IV device architecture (see Stratix IV Device Handbook). It delivers a large programmable fabric and on-chip resources tailored for high-bandwidth data processing, complex logic integration, and dense I/O requirements.

Designed for commercial applications, this FPGA combines hundreds of thousands of logic elements, substantial embedded RAM, and a high I/O count to support advanced communications, signal processing, and system integration tasks while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Capacity — 353,600 logic elements for implementing large-scale custom logic, protocol processing, and system control functions.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support frame buffers, FIFOs, and large data structures without external memory in some designs.
• I/O Density — 880 device I/Os to support wide parallel interfaces, multiple memory channels, and extensive peripheral connectivity.
• Stratix IV Architecture — Device handbook describes features such as high-speed transceivers, DSP blocks, PLLs and advanced clock networks suited to high-performance designs.
• Package — 1760-FCBGA (42.5 × 42.5 mm) / 1760-BBGA package options providing a high-pin-count, compact footprint for board-level integration.
• Power — Core voltage supply range of 870 mV to 930 mV for core power planning and regulator selection.
• Mounting & Compliance — Surface-mount device construction and RoHS-compliant material status.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C for typical commercial applications.

Typical Applications

• Telecom & Datacom — High logic capacity and dense I/O make the device suitable for packet processing, protocol bridging, and aggregation tasks in commercial networking equipment.
• High-Performance Signal Processing — Large embedded RAM and Stratix IV DSP/clocking capabilities support demanding DSP pipelines and multi-channel data handling.
• Instrumentation & Test Equipment — Extensive I/O and flexible logic fabric enable custom measurement, data acquisition and real-time analysis implementations.
• Broadcast & Video Processing — On-chip memory and rich logic resources facilitate frame buffering, format conversion, and high-throughput video pipelines.

Unique Advantages

• High logic density: 353,600 logic elements provide the capacity to consolidate multiple functions and reduce external glue logic.
• Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM reduce the dependence on external memory for many buffering and caching tasks.
• Extensive I/O availability: 880 I/Os enable broad system interfacing and support for parallel buses and multi-lane connections.
• Commercial-ready package: 1760-FCBGA package offers a compact, high-pin-count solution for dense PCB designs.
• Clear power and thermal envelope: Documented core voltage range (870–930 mV) and commercial operating temperature (0 °C to 85 °C) simplify system-level power and thermal planning.
• Standards-focused manufacturing: Surface-mount assembly and RoHS compliance support modern manufacturing processes.

Why Choose EP4SGX360KF43C2G?

The EP4SGX360KF43C2G positions itself as a high-capacity Stratix IV FPGA option for commercial systems that require large programmable logic, abundant embedded memory, and dense I/O in a single package. Its specified voltage and temperature ranges, along with RoHS compliance and a compact FCBGA footprint, make it suitable for volume commercial designs where integration and performance are priorities.

This device is well suited for engineering teams building communications, signal processing, and data-intensive applications that benefit from a mature device architecture and comprehensive on-chip resources as described in the Stratix IV Device Handbook.

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