EP4SGX360KF43C2

The EP4SGX360KF43C2 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1760-ball FCBGA package. It delivers a high logic capacity and substantial embedded memory in a surface-mount package for commercial-grade designs.

With 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM and 880 I/O, this device targets high-density programmable logic implementations that require large fabric capacity and a high pin count within a compact FCBGA footprint.

Key Features

• Core Logic Capacity: 353,600 logic elements to support large, complex designs.
• Embedded Memory: Approximately 23.1 Mbits of on-chip RAM for buffering, state storage, and data-path implementation.
• I/O Capability: 880 I/O pins to support broad interfacing requirements and system integration.
• Power Supply Range: Voltage supply specified from 870 mV to 930 mV.
• Package & Mounting: 1760-FCBGA package (42.5 × 42.5 mm) with surface-mount mounting for compact board layouts.
• Operating Conditions: Commercial-grade operation specified from 0 °C to 85 °C.
• Standards Compliance: RoHS compliant.

Typical Applications

• High-density signal processing: Use the 353,600 logic elements and approximately 23.1 Mbits of embedded memory to implement DSP kernels, algorithm acceleration, and large datapaths.
• Complex I/O interfacing: The 880 I/O pins provide the connectivity needed for multi-protocol bridging, board-level aggregation, and system control functions.
• System integration and control: Compact FCBGA packaging and surface-mount mounting make the device suitable for space-constrained boards requiring significant programmable logic.

Unique Advantages

• Large programmable fabric: 353,600 logic elements enable substantial on-chip logic integration to consolidate functions and reduce external components.
• Significant on-chip memory: Approximately 23.1 Mbits of RAM supports buffering and stateful functions without immediate reliance on external memory.
• High I/O count: 880 I/O connections simplify board-level interfacing and permit extensive system connectivity.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) offers a balance of density and manufacturability for surface-mount assembly.
• Commercial temperature rating: Rated for 0 °C to 85 °C to match a wide range of commercial applications.
• Regulatory compliance: RoHS compliant for environmental and regulatory alignment.

Why Choose EP4SGX360KF43C2?

The EP4SGX360KF43C2 combines very high logic capacity, substantial embedded memory, and a large I/O complement in a compact 1760-FCBGA surface-mount package. As a Stratix® IV GX device from Intel, it is positioned for commercial designs that require extensive programmable resources and dense I/O in a board-friendly footprint.

This part is suited to designers and systems integrators building complex, high-density FPGA-based subsystems where on-chip logic and memory consolidation, along with a high pin count, deliver integration benefits and simplified board-level design. Its commercial-grade temperature range and RoHS compliance support deployment in a wide range of non-automotive applications.

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