EP4SGX360KF43C3

The EP4SGX360KF43C3 is an Intel Stratix IV GX field-programmable gate array supplied in a 1760-FCBGA package (42.5 × 42.5 mm). It delivers high logic capacity, substantial on-chip RAM, and a large I/O count for complex, programmable hardware designs.

Key on-chip resources include 353,600 logic elements and approximately 23 Mbits of embedded memory, with 880 I/O pins. The device operates from 870 mV to 930 mV, is graded for commercial operation from 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Core Logic 353,600 logic elements provide significant capacity for large-scale custom logic, parallel processing, and hardware acceleration.
• Embedded Memory Approximately 23 Mbits of on-chip RAM support data buffering, FIFOs, and memory-intensive designs without relying solely on external memory.
• I/O Count 880 I/O pins enable broad connectivity for multi-channel interfaces, high-density board routing, and interfacing with numerous peripherals.
• Power Operates from a core supply range of 870 mV to 930 mV, enabling compatibility with precise supply designs.
• Package 1760-FCBGA package (42.5 × 42.5 mm) provides a high-pin-count, surface-mount solution for dense PCB implementations.
• Temperature & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliance for standard commercial product deployments.

Typical Applications

• High-density Prototyping and Custom Logic — Use the device’s large logic element count to implement complex, custom digital functions and prototype system-on-chip designs.
• Data Buffering and Memory-intensive Functions — Approximately 23 Mbits of embedded RAM supports on-chip storage for buffering, packet buffering, and streaming data handling.
• Complex I/O and Interface Aggregation — 880 I/Os make this FPGA suitable for aggregating multiple high-pin-count interfaces and connecting numerous peripherals.

Unique Advantages

• High Logic Capacity: 353,600 logic elements allow integration of extensive custom logic and parallel processing engines on a single device.
• Substantial On-chip Memory: Approximately 23 Mbits of embedded RAM reduce dependence on external memory for many buffering and intermediate-data tasks.
• Large I/O Count: 880 I/Os provide the pin density required for multi-channel systems and complex interface routing.
• Compact High-pin Package: The 1760-FCBGA (42.5 × 42.5 mm) offers a surface-mount form factor that supports high-density PCB designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.

Why Choose EP4SGX360KF43C3?

The EP4SGX360KF43C3 positions itself for designs that require a combination of large programmable logic capacity, meaningful on-chip memory, and a high number of I/Os in a single packaged FPGA. Its specification set supports system designers implementing complex digital processing, interface aggregation, and memory-buffered functions within commercial-temperature products.

For teams focused on scalability and integration, this Stratix IV GX device provides measurable on-chip resources and a high-pin-count BGA package to streamline board-level design and consolidate functions that might otherwise require multiple components.

Request a quote or submit an inquiry for pricing and availability of EP4SGX360KF43C3 to evaluate suitability for your next FPGA-based design.